Dave Armstrong
Director, Business Development, Advantest America, Inc.

In his capacity as Director of Business Development, Dave Armstrong works directly with customers and Advantest’s global R&D teams to define develop and deliver creative solutions to the most demanding test challenges. Additionally, Dave is currently the Chairman of the Test Working Group of the Heterogeneous Integration Roadmap.

Prior to joining Advantest in 2004, Dave spent over two decades in HP/Agilent’s IC test group achieving the role of Principal Engineer. Prior to joining HP Dave worked in the semiconductor industry in areas of IC and system design, product/yield engineering, as well as test engineering. Dave Armstrong received degrees in Electrical, Computer, and Environmental Engineering from the University of Michigan in 1974.

Wilmer (Bill) R. Bottoms, Ph.D.
Chairman, Third Millennium Test Solutions

Dr. Bottoms received his PhD in Physics from Tulane University in 1969 and is currently Chairman of Third Millennium Test Solutions. He has served as a faculty member at Princeton University, manager of Research and Development at Varian Associates, founding President of the Semiconductor Equipment Group of Varian Associates, general Partner of Patricof & Co. Ventures as well as Chairman and CEO of several companies both public and private, He has also served as a member of several government advisory groups.

Dr. Bottoms currently serves as Co-chair of the Heterogeneous Integration Technology Roadmap for Semiconductors (HITRS), Chairman of the Packaging and Component Substrates Technical Working Group for INEMI, Emeritus Member of the Board of Tulane University, Chairman of the Semiconductor Equipment and Materials International’s SEMI Awards Committee, and Chairman of APMT.

Krishna Darbha, Ph.D.
Senior Director of Reliability at the Microsoft Devices Business Group (MDG) at Microsoft

Krishna Darbha has been w/ Microsoft for the past 15 plus years and is currently responsible for Reliability of Surface. He has managed Reliability of many complex multi-physics consumer electronic products and worked on products like Xbox, PCHW peripherals, Zune and Surface Table Top. Prior to Microsoft he was with IBM in the Microelectronics Division responsible for multi-physics analysis of cutting-edge microelectronic modules. He obtained his Ph.D. in Mechanical Engineering from the University of Maryland (College Park) in 1999. He covers Reliability through the entire product life cycle starting from up-front product development relying on quantification of user scenarios, efficient virtual qualification techniques, qualification of supply-chain, development of acceleration models for new failure modes, demonstration of reliability goals and quality assurance via ORT and other CTQ monitors in mainstream production. He is a member of ASME and IEEE and contributed through publishing and reviewing papers in conferences and journals for over 20 years. He currently holds 10 patents.

Ramakanth Alapati
VP, Strategic Development, Amkor Technology, Inc.

Rama joined Amkor in 2016 and is currently responsible for the technology strategy team focused on technology innovation, pathfinding and defining technology and product roadmaps. Prior to joining Amkor, Rama led the packaging product management group at GLOBALFOUNDRIES and previously worked for Micron Technology and IMEC. He has more than 25 granted patents, publications and invention disclosures and holds a Bachelor’s degree in chemical technology from Osmania University in Hyderabad, India and a Masters in chemical engineering from the University of Kansas, Lawrence.

William (Bill) Chen, Ph.D.
ASE Fellow, Senior Technical Advisor, ASE Group

Bill Chen holds the position of ASE Fellow and Senior Technical Advisor at ASE Group. Prior to joining ASE, he was the Director at the Institute of Materials Research & Engineering in Singapore. Bill retired from IBM Corporation after a career spanning over thirty years in various R&D positions. He has held adjunct and visiting faculty positions at Cornell University, Hong Kong University of Science and Technology, and Binghamton University. Currently, he is the co-chair of the ITRS Assembly Packaging Technical Working Group. He also chairs SEMI’s Advanced Packaging Committee. In 2009, Bill received the InterPACK Excellence Award for his contributions, and in 2010, he was presented with the IEEE CPMT David Feldman Outstanding Contribution Award. He was a past President of the IEEE CPMT Society, and has been elected a Fellow of IEEE and a Fellow of ASME. Bill has served as a member of the Board of iNEMI since 2012. Bill received B. Sc. from London University, M.Sc. from Brown University and Ph.D. from Cornell University.

Abhijit Dasgupta, Ph.D.
Jeong H. Kim Professor, Department of Mechanical Engineering, University of Maryland

Abhijit obtained his Ph.D. in Theoretical & Applied Mechanics from the University of Illinois in Urbana-Champaign and has since served as a faculty member of Mechanical Engineering and a principal investigator at the Center of Advanced Life Cycle Engineering (CALCE) at the University of Maryland. He has 30 years of expertise in the microscale and nanoscale multi-physics behavior of engineered materials that are used in semiconductor and microsystems packaging. He applies this expertise for the development, accelerated stress testing, and real-time health monitoring of reliable micro-systems. He has published over 300 articles and conference papers; served on editorial boards of three international archival journals; presented over 40 workshops and short courses; helped form research and educational roadmaps for the electronics industry, and provided consulting services to numerous industry leaders. He is an ASME Fellow, a past Chair of the ASME Electronic and Photonics Packaging Division (EPPD) and currently serves on the leadership team of the ASME Design, Materials and Manufacturing (DMM) Segment.

Gerard John
Sr. Director, Advanced Packaging R&D, Amkor Technology

Gerard joined Amkor in 2005, and has supported and managed hardware and software test development for a variety of Amkor packaging. He currently serves as an advanced test technical expert for MEMS, 2.5D, WLFO, HDFO, fine pitch probe and optical devices, supporting customers in the US and Europe. Prior to joining Amkor, Gerard worked in various semiconductor test positions for Conexant Systems, Flarion Technologies (acquired by Qualcomm) and Motorola. He holds a BA degree in electronics and telecommunications engineering from Osmania University and an MBA from Gainey School of Business in Michigan.

Amy Leong
Senior Vice President, Marketing & Customer Solutions

Amy Leong has been with FormFactor since October 2012. Prior to this, Amy was the VP of Marketing at MicroProbe from April 2010 through the October 2012 closing of FormFactor’s acquisition of MicroProbe. Before joining MicroProbe, Ms. Leong worked at Gartner, Inc. as a Research Director from 2008 to 2010 and covered the ASSP system-on-chip and microcontroller markets. From 2003 to 2008, Ms. Leong worked at FormFactor where she served as Senior Director of Corporate Strategic Marketing and Director of DRAM Product Marketing. Prior to FormFactor, Ms. Leong worked in a variety of semiconductor process engineering and product marketing roles at KLA-Tencor and IBM.

Ms. Leong holds an M.S. in Material Science and Engineering from Stanford University and a B.S. in Chemical Engineering from the University of California, Berkeley.

Jawad Nasrullah, Ph.D.
Co-founder, President and Chief Technology Officer, zGlue

Dr. Jawad Nasrullah, as an award-winning inventor and expert in low-power and energy-efficient designs for high- speed IO and 3D-ICs, his career has spanned a number of roles at some of the top technology companies in Silicon Valley. As one of zGlue’s co-founders, and president and chief technology officer, Nasrullah’s role includes technology development and engineering operation. Before co-founding the company with Dr. Ming Zhang and Myron Shak, he was a principal engineer at Samsung where he developed low-power design technologies for use in mobile and server SoCs. Prior to that, he was a hardware architect with Intel for several years, where he was responsible for low-power silicon architecture solutions for 22/14/10nm microprocessors, and several patent-pending inventions, including on-off keying-based power management technology. Nasrullah earned his Ph.D. in electrical engineering from Stanford University with an emphasis on ultra-low power technology. He holds 14 U.S. patents issues/pending, and is the recipient of a number of national and institutional awards for academic achievements and commercial contributions. Nasrullah is a senior member of IEEE.

Kevin Rinebold
Technology Manager, Advanced Packaging Solutions, Mentor

Kevin is the Technology Manager for Advanced Packaging Solutions at Mentor, A Siemens Business. He has 27 years of experience in defining, developing, and supporting advanced packaging and system planning solutions for the semiconductor and systems markets. He has defined and pioneered some of the earliest solutions for IC-PKG-PCB co-design. He’s a regular contributor at industry events and has authored numerous articles on planning and design methodologies. Prior to joining Mentor, Kevin was Product Manager for IC packaging and co-design products at Cadence. He’s held similar positions at Sigrity, Synopsys, and Xynetix.

Suresh Ramalingam, PhD.
Fellow, Manager Advanced Packaging Interconnect Technology Development , Xilinx

Dr. Suresh Ramalingam graduated in 1994 with a Ph.D. in Chemical Engineering from Massachusetts Institute of Technology, Cambridge. He holds 24 US Patents, 2013 SEMI Award, Ross Freeman Award for Technical Innovation, ECTC 2011 Conference Best Paper Award, IMAPS 2013 and 2014 Conference Best Paper Awards for 2.5D/3D. He started his career at Intel developing Organic Flip Chip Technology for Micro-processors which was implemented on Pentium I (Intel’s first flip chip product for laptops) in 1997. As one of the co-founders and Director of Packaging Materials at Scion Photonics he helped develop DWDM modules used by major communication companies. JDS Uniphase acquired Scion Photonics in 2002. As a Xilinx Fellow, he currently manages Advanced Packaging Interconnect Technology Development including TSV/3D for Xilinx FPGA products.

Keith Schaub
Vice President Corporate Business Development, W2BI/Advantest

Keith Schaub Vice Preside of Corporate Business for W2BI/Advantest, author of the book, Production testing of RF and SOC devices for Wireless Communications, has over 23 years of experience in RF systems architecture and test engineering. Holds 5 related patents and has authored/co-authored papers and editorials on the state of RF/wireless SOC/SIP testing and the trends of the market.

Milena Vujosevic, Ph.D.
Principal Engineer, Senior Technology Development Manager, Intel

Dr. Milena Vujosevic is a Principal Engineer and Sr. Manager at Intel. She has 20+ years of experience in the Semiconductor industry, working in the areas of technology development, design, and quality and reliability for MEMS, electronic packaging and systems. At Intel she drives strategic developments in reliability methodologies to enable future generations packaging technologies. Prior to joining Intel in 2005, she worked for Motorola. She is a recipient of 2011 ASME Women Engineer of the year award for significant achievements in the field of electronic and photonic packaging.

Farhang Yazdani
President and CEO, BroadPak Corporation

Farhang Yazdani is the President and CEO of BroadPak Corporation. His company provides total solution, technologies and design services to help its clients develop and lunch 2.5D/3D heterogeneous products. Through his 18 years with the industry, he has served in various technical, management, and advisory positions with leading semiconductor companies worldwide. He has numerous publications and IPs in the area of 2.5D/3D Packaging and Assembly, serves on various technical committees and is a frequent reviewer for IEEE Journal of Advanced Packaging. He received his undergraduate and graduate degrees in Chemical Engineering and Mechanical Engineering from the University of Washington, Seattle.

Gamal Refai-Ahmed, Ph.D.
Distinguished Engineer at Xilinx, ASME Life Fellow ASME, Fellow Canadian Academy of Engineering and Adjunct Professor in Watson School of Engineering and Applied Science at SUNY Binghamton

Dr. Refai is Distinguished Engineer at Xilinx, ASME Life Fellow ASME, Fellow Canadian Academy of Engineering and Adjunct Professor in Watson School of Engineering and Applied Science at SUNY Binghamton. He obtained the M. A. SC. and Ph. D. degrees in Mechanical Engineering from the University of Waterloo.

Dr. Refai is an Associate Editor of Journal Components and Packaging, IEEE and Journal of thermal Sciences and Engineering and Applications, Transactions of the ASME. Gamal is the recipient of 2008 excellent thermal management award, 2010 best Associate Editor J Electronics Packaging, 2010 Calvin Lecture and 2013 K16- Clock award in recognition for his scientific contributions and leadership of promoting best electronics packaging engineering practice. In 2014, Gamal received the IEEE Canada R. H. Tanner Industry Leadership for sustained leadership in product development and industrial innovation. In 2015, the ASME service award and the IEEC SUNY Binghamton Innovation leader of the year.

Scott Sikorski, Ph.D.
Vice President of Product Technology Marketing, STATS ChipPAC

Dr. Scott Sikorski joined STATS ChipPAC in 2009 after a 20 year career with IBM Microelectronics during which time he held positions in R&D, Manufacturing, Product Line Management, Business Management and Marketing. Upon joining STATS ChipPAC, Dr. Sikorski was responsible for the Wirebond and Test product line areas and moved to head of Corporate Strategy in late 2012 before assuming his current position as Vice President of Product Technology Marketing in December 2014. In his current role, he is responsible for leading the company’s marketing and business development activities in advanced packaging technology. Dr. Sikorski received his Bachelor of Science degree from Columbia University’s School of Engineering and Applied Sciences in Metallurgical Engineering and his Master’s degree and Ph.D. from the Massachusetts Institute of Technology, both in Materials Engineering.

Ivor Barber
Corporate Vice President for Packaging, AMD

Ivor Barber is Corporate Vice President for Packaging at AMD. An industry veteran, Ivor has over 35 years experience in package assembly, design and characterization including 23 years at LSI Corporation in Milpitas in various Engineering and Leadership positions in Packaging and 4 years as Senior Director of Package Process Technology Development at Xilinx. Ivor graduated from Napier University in Edinburgh, Scotland with a Bachelors degree in Technology and holds 13 US patents related to package design.

Urmi Ray, Ph.D.
Senior Director, Product Technology Marketing, STATS ChipPAC, Inc.

Dr. Urmi Ray is a Senior Director of Product and Technology Marketing for STATS ChipPAC, focusing on advanced SystemÐin-Package (SiP) solutions. Before joining STATS ChipPAC, she spent 11 years at Qualcomm, developing advanced technologies such as 2.5D and 3D solutions, multi-chip package integration and interactions. Prior to this, she worked at Lucent Technologies Bell Labs in multiple areas related to electronics assembly and reliability. Dr. Ray received her Ph.D. from Columbia University in New York City. She has been actively involved in the semiconductor industry with several conference publications as well as patented inventions in the field of advanced packaging. She is also currently serving on the Board of Directors for the International Microelectronics Assembly and Packaging Society (IMAPS) as the Vice President of Technology.

Rich Rice
Senior Vice President of Sales, North America, ASE (U.S.) Inc.

Rich Rice is Senior Vice President of Sales for ASE (U.S.) Inc., with responsibility for the North American region. Appointed in 2003, Mr. Rice oversees field sales and engineering support teams. Prior to joining ASE, Mr. Rice spent over ten years at Amkor Technology, where he held various management roles, including Vice President of Sales and Vice President of Business Development. Previously, Mr. Rice performed engineering roles at Nara Technologies and National Semiconductor Corporation. Mr. Rice holds a BS degree in Agricultural Engineering from the University of Illinois.

Jeff Demmin
Senior Lead Scientist at Booz Allen Hamilton

Jeff helps manage microelectronics R&D programs in the Microsystems Technology Office of DARPA. He was previously the Director of OEM Marketing at STATS ChipPAC, and before that he worked at Tessera Technologies in marketing, corporate development, and IP acquisition. He has also served as the Editor-in-Chief of Advanced Packaging magazine and Senior Technical Editor of Solid State Technology magazine. His career started in semiconductor package design at National Semiconductor, and a sequence of engineering roles at nCHIP, Seagate, and Textron followed that. Jeff earned a bachelor’s degree in Physics from Princeton University and a master’s degree in Materials Science from Stanford University. He was awarded a gold medal from the American Society of Business Publication Editors (ASPBE), and he has been around long enough that all of his patents on IC package design have expired.

Herb Reiter
President of eda 2 asic Consulting, Inc.

Herb Reiter is President of eda 2 asic Consulting, Inc After more than 20 years in engineering and business development roles at ASIC vendors and EDA software companies, Herb founded eda2asic Consulting, Inc. in 2002. Initially he introduced tools and IP for simplifying single-die “2D-ICs” design efforts.

As continued feature size shrinking became too difficult and costly for many applications, Herb started in 2008 to focus on 2.5D and 3D-IC design, manufacturing and test challenges. As consultant to industry organizations (GSA, SEMATECH, Si2, ESD Alliance) Herb organized conferences and workshops, to accelerate building the EcoSystem for multi-die ICs and advanced packaging technologies. Herb frequently blogs about innovation in this field on the 3D InCites media platform.

Herb earned an MSEE and MBA degree in Austria/EUROPE, an MBA from San Jose State University and has attended more than 40 Continuing Education Classes at Stanford University.

Paul Werbaneth
Global Product Marketing Director, Intevac, Inc.

Paul Werbaneth is the Global Product Marketing Director at Intevac, Inc., where he works on market requirements, product strategy definitions, pricing, business plans, and product positioning to drive competitive advantage, revenue, and market share in the thin film equipment business. Prior to Intevac, Paul was a journalist and writer covering advanced CMOS IC fabrication, 2.5D/3D IC technology and commercialization, the MEMS industry, and the compound semiconductor world. His blog, 3D+: Inspired by Heterogeneous Integration, investigates how these technologies will be integrated together into next-generation applications and considers aspects of how they will achieve commercial success by doing so. Paul’s professional experience includes positions as a business development manager at EV Group; vice president of marketing and applications at Tegal Corporation; country manager for Tegal Japan Inc.; senior plasma etch process engineer with Hitachi High Technologies; and as a hands-on process sustaining engineer in an Intel wafer fab.

Paul holds a B.S. in chemical engineering from Cornell University, and recently completed studies in spoken Japanese through the Cornell Summer FALCON program, and in Marketing Strategy, also through Cornell.