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SEMI is the global industry association serving the nano- and micro-electronic manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. |
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Advanced Component Labs, Inc., is the USA's leading fabricator of "Time Critical" High Density Interconnects.· With a sharp focus directed towards the semiconductor packaging community; ACL's Flip Chip, BGA, MCM and SIP fabrications offer a perfect response to the market's constantly increasing need for shorter lead times and improved device performance. |
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Tohoku-MicroTec (T-Micro) is the 2.5D/3D IC foundry service company. Our facility “GINTI” equips a complete and state‐of‐the‐art 3D line of 200/300 mm wafer. Using the base technology originally developed at Tohoku University in Japan, we offer worldwide customers a variety of 2.5D/3D-IC stacking technology of CtC, CtW and WtW with TSV and micro bump as well as high throughput self-assembly for heterogeneous devices. Our cost‐competitive process infrastructure provides worldwide customers with a cost‐effective and short‐term TAT prototyping service for fundamental R&D, technology evaluation, “proof of concept” projects, and 2.5D/3D device development. |
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zGlue was founded in late 2014 by industry veterans with diverse technology backgrounds covering every aspect of semiconductors, software and systems design, and manufacturing. Delivering the first major breakthrough in chip and system design methodology for the IoT era, zGlue has pioneered a new category of semiconductor/SaaS company. With strong financial backing, strategic partners, suppliers and investors, and a proven system integration platform, zGlue is well positioned to become an industry leader in the rapidly growing IoT market. zGlue is headquartered in the Silicon Valley and has an office in Shanghai, China. |
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SHINKO Electric Industries Co., LTD., is a leading manufacturer of products used in the assembly of IC’s such as Organic Substrates, Etched and Stamped Leadframes, TO Packages and Integrated Heatspreaders. SHINKO manufactures a full line of Organic Substrate structures including coreless options offering enhanced electrical performance and package size reduction. SHINKO also offers subcontract IC assembly services with an emphasis on advanced packaging technologies such as our Molded Core embedded Package (MCeP®), PoP, SiP as well as other complex module solutions. SHINKO is headquartered in Nagano, Japan and delivers the ultimate in service and solutions with Sales and Engineering support Worldwide.
Stars Microelectronics is a fully automated, full service OSAT company based in Thailand for a wide range of small outline IC packages that includes multiple variations in small package outlines and package thickness down to 0.30mm. Package portfolio includes DFN, QFN, TDFN, TQFN, UDFN, XDFN, XQFN, X2DFN, MSOP, SOT, SOIC, TSOT, TSSOP, MEMS, SENSORS, SIP, Flex, PCBA. Stars Microelectronics is also an electronics manufacturing services (EMS) provider serving various markets that produces Medical devices, Optical components, Automotive devices, advanced consumer products and box builds, niche and other specialty packaging. Publicly traded in Thailand, and for years, have developed the infrastructure to meet high customer demands for quality assurance and competitive costs. Stars Microelectronics has numerous awards and recognition, and is current on all certifications – ISO13485, ISO/TS16949, ISO14001, ISO9001, OHSAS18001.
Sentec Electro Ceramic & Device Group offers various substrate and IC packaging solutions. Process Technologies were transferred from Panasonic since 1999.
Main Products:
• High Accuracy Multi-Layer LTCC Substrate (X,Y !S0.05%)
• Non-Shrinkage Ceramic Interposer
• Cu Slug in Ceramic Substrate (>300W/m’k)
• Cavity Package (QFN, Custom Lead Frame)
• Direct Plating Technology on Al2O3 & AlN Substrate
• Hermetic Ceramic Package (10^-8)
• Custom Thin/Thick Film Process Service
• Turnkey IC Packaging Service
SMART Microsystems creates turn-key solutions for microelectronic package assembly challenges to move MEMS sensor technology from development to production. With an engineering team experienced in manufacturing and state-of-the-art facilities, SMART Microsystems accelerates the transition of new MEMS sensor products to market, providing the lowest overall development time and cost to satisfy full life cycle requirements. Visit www.smartmicrosystems.com for more information about SMART Microsystems capabilities and services.
Amkor Technology, Inc. is one of the world’s largest and most accomplished providers of semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC assembly and test and is a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base encompasses more than 8M ft2 of floor space with production facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.
Promex provides mixed technology assembly processes that integrate conventional surface mount technology (SMT) with semiconductor microelectronic packaging and assembly methods for flip chip or chip/wire devices. The company operates a 30,000 square foot assembly facility with Class 100 and 1000 clean rooms in Silicon Valley that is ISO 13485:2003 and ISO 9001:2008 certified, ITAR registered and compliant to regulatory requirements for medical products. With a highly skilled engineering team, Promex combines broad technical capabilities, advanced packaging and microelectronics assembly expertise with scalable manufacturing capacity to fast track new medical and bioscience products to volume production.
SMART Microsystems creates turn-key solutions for microelectronic package assembly challenges to move MEMS sensor technology from development to production. With an engineering team experienced in manufacturing and state-of-the-art facilities, SMART Microsystems accelerates the transition of new MEMS sensor products to market, providing the lowest overall development time and cost to satisfy full life cycle requirements. Visit www.smartmicrosystems.com for more information about SMART Microsystems capabilities and services.
Smoltek is a privately held company based in Sweden that specializes in development of nanostructure fabrication technology to solve advanced materials engineering problems. Smoltek has developed SMOLTEK Tiger™, a proprietary nanostructure technology platform that enables formation of nanostructures optimized for advanced semiconductor packaging applications. Smoltek protects its innovative nanomaterials technology with a portfolio of more than 60 patents granted and pending, as well as a significant body of know-how and trade secrets.
Smoltek is a privately held company based in Sweden that specializes in development of nanostructure fabrication technology to solve advanced materials engineering problems. Smoltek has developed SMOLTEK Tiger™, a proprietary nanostructure technology platform that enables formation of nanostructures optimized for advanced semiconductor packaging applications. Smoltek protects its innovative nanomaterials technology with a portfolio of more than 60 patents granted and pending, as well as a significant body of know-how and trade secrets.
Amkor Technology, Inc. is one of the world’s largest and most accomplished providers of semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC assembly and test and is a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base encompasses more than 8M ft2 of floor space with production facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.
SHENMAO Technology, Inc. BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and extremely high-quality sphericity. SHENMAO ADVANCED MATERIALS DEVELOPMENT CENTER applications engineers developed the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. SHENMAO has successfully been approved by many international well-known electronic manufacturers. SHENMAO strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Laser Soldering Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Flux and Solar PV Ribbon. SHENMAO America, Inc. blends SMT Solder Paste in its facility in San Jose, CA for distribution in North America.
Promex provides mixed technology assembly processes that integrate conventional surface mount technology (SMT) with semiconductor microelectronic packaging and assembly methods for flip chip or chip/wire devices. The company operates a 30,000 square foot assembly facility with Class 100 and 1000 clean rooms in Silicon Valley that is ISO 13485:2003 and ISO 9001:2008 certified, ITAR registered and compliant to regulatory requirements for medical products. With a highly skilled engineering team, Promex combines broad technical capabilities, advanced packaging and microelectronics assembly expertise with scalable manufacturing capacity to fast track new medical and bioscience products to volume production.
ASE Group
Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging and System-in-Package solutions to meet growth momentum across a broad range of end markets. For more about our advances in SiP, WLP, Fan Out, MEMS, Flip Chip, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com. To follow ASE on Twitter: @asegroup_global.
STATS ChipPAC is a leading service provider of semiconductor design, wafer bump, probe, packaging and test solutions for well-established markets such as communications, consumer and computing as well as emerging markets in automotive electronics, Internet of Things (IoT) and wearable devices. With an advanced technology portfolio and a global manufacturing presence spanning Singapore, South Korea, and China, STATS ChipPAC provides innovative integration solutions in wafer level packaging, flip chip interconnect and advanced System-in-Packages (SiP) to meet increasing market demand for higher performance, functionality and processing speeds with a significant reduction in space in an electronics device. STATS ChipPAC is a member of the JCET group of companies.
ASE Group
Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging and System-in-Package solutions to meet growth momentum across a broad range of end markets. For more about our advances in SiP, WLP, Fan Out, MEMS, Flip Chip, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com. To follow ASE on Twitter: @asegroup_global.
Silex Microsystems is the world’s largest pure-play MEMS foundry enabling the world’s most innovative companies to participate in the sensory system revolution and commercialize MEMS technologies that are transforming the world.
MEMS development requires deep specialized knowledge and expertise as a new device goes from prototype to qualification to mass production. Silex is dedicated in brining customers quickly, cost-effectively and reliably through the product development lifecycle with:
• Expertise in rapid commercialization of MEMS products
• Pioneering innovation that delivers transformative MEMS manufacturing capabilities
• Responsive Collaborative partnering driven to enable customers’ success, from project inception to volume production
• Proven, stable, high-volume MEMS manufacturing capacity
Stars Microelectronics is a fully automated, full service OSAT company based in Thailand for a wide range of small outline IC packages that includes multiple variations in small package outlines and package thickness down to 0.30mm. Package portfolio includes DFN, QFN, TDFN, TQFN, UDFN, XDFN, XQFN, X2DFN, MSOP, SOT, SOIC, TSOT, TSSOP, MEMS, SENSORS, SIP, Flex, PCBA. Stars Microelectronics is also an electronics manufacturing services (EMS) provider serving various markets that produces Medical devices, Optical components, Automotive devices, advanced consumer products and box builds, niche and other specialty packaging. Publicly traded in Thailand, and for years, have developed the infrastructure to meet high customer demands for quality assurance and competitive costs. Stars Microelectronics has numerous awards and recognition, and is current on all certifications – ISO13485, ISO/TS16949, ISO14001, ISO9001, OHSAS18001.