Tohoku-MicroTec (T-Micro) is the 2.5D/3D IC foundry service company. Our facility “GINTI” equips a complete and state‐of‐the‐art 3D line of 200/300 mm wafer. Using the base technology originally developed at Tohoku University in Japan, we offer worldwide customers a variety of 2.5D/3D-IC stacking technology of CtC, CtW and WtW with TSV and micro bump as well as high throughput self-assembly for heterogeneous devices. Our cost‐competitive process infrastructure provides worldwide customers with a cost‐effective and short‐term TAT prototyping service for fundamental R&D, technology evaluation, “proof of concept” projects, and 2.5D/3D device development.

www.t-microtec.com

zGlue was founded in late 2014 by industry veterans with diverse technology backgrounds covering every aspect of semiconductors, software and systems design, and manufacturing. Delivering the first major breakthrough in chip and system design methodology for the IoT era, zGlue has pioneered a new category of semiconductor/SaaS company. With strong financial backing, strategic partners, suppliers and investors, and a proven system integration platform, zGlue is well positioned to become an industry leader in the rapidly growing IoT market. zGlue is headquartered in the Silicon Valley and has an office in Shanghai, China.

www.zglue.com

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SMART Microsystems creates turn-key solutions for microelectronic package assembly challenges to move MEMS sensor technology from development to production. With an engineering team experienced in manufacturing and state-of-the-art facilities, SMART Microsystems accelerates the transition of new MEMS sensor products to market, providing the lowest overall development time and cost to satisfy full life cycle requirements. Visit www.smartmicrosystems.com for more information about SMART Microsystems capabilities and services.

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Amkor Technology, Inc. is one of the world’s largest and most accomplished providers of semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC assembly and test and is a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base encompasses more than 8M ft2 of floor space with production facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.

www.amkor.com

Promex provides mixed technology assembly processes that integrate conventional surface mount technology (SMT) with semiconductor microelectronic packaging and assembly methods for flip chip or chip/wire devices. The company operates a 30,000 square foot assembly facility with Class 100 and 1000 clean rooms in Silicon Valley that is ISO 13485:2003 and ISO 9001:2008 certified, ITAR registered and compliant to regulatory requirements for medical products. With a highly skilled engineering team, Promex combines broad technical capabilities, advanced packaging and microelectronics assembly expertise with scalable manufacturing capacity to fast track new medical and bioscience products to volume production.

www.promex-ind.com

SMART Microsystems creates turn-key solutions for microelectronic package assembly challenges to move MEMS sensor technology from development to production. With an engineering team experienced in manufacturing and state-of-the-art facilities, SMART Microsystems accelerates the transition of new MEMS sensor products to market, providing the lowest overall development time and cost to satisfy full life cycle requirements. Visit www.smartmicrosystems.com for more information about SMART Microsystems capabilities and services.

Smoltek is a privately held company based in Sweden that specializes in development of nanostructure fabrication technology to solve advanced materials engineering problems. Smoltek has developed SMOLTEK Tiger™, a proprietary nanostructure technology platform that enables formation of nanostructures optimized for advanced semiconductor packaging applications. Smoltek protects its innovative nanomaterials technology with a portfolio of more than 60 patents granted and pending, as well as a significant body of know-how and trade secrets.

www.smoltek.com

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Smoltek is a privately held company based in Sweden that specializes in development of nanostructure fabrication technology to solve advanced materials engineering problems. Smoltek has developed SMOLTEK Tiger™, a proprietary nanostructure technology platform that enables formation of nanostructures optimized for advanced semiconductor packaging applications. Smoltek protects its innovative nanomaterials technology with a portfolio of more than 60 patents granted and pending, as well as a significant body of know-how and trade secrets.

www.smoltek.com

Amkor Technology, Inc. is one of the world’s largest and most accomplished providers of semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC assembly and test and is a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base encompasses more than 8M ft2 of floor space with production facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.

www.amkor.com

SHENMAO Technology, Inc. BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and extremely high-quality sphericity. SHENMAO ADVANCED MATERIALS DEVELOPMENT CENTER applications engineers developed the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. SHENMAO has successfully been approved by many international well-known electronic manufacturers. SHENMAO strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Laser Soldering Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Flux and Solar PV Ribbon. SHENMAO America, Inc. blends SMT Solder Paste in its facility in San Jose, CA for distribution in North America.

www.shenmao.com

Promex provides mixed technology assembly processes that integrate conventional surface mount technology (SMT) with semiconductor microelectronic packaging and assembly methods for flip chip or chip/wire devices. The company operates a 30,000 square foot assembly facility with Class 100 and 1000 clean rooms in Silicon Valley that is ISO 13485:2003 and ISO 9001:2008 certified, ITAR registered and compliant to regulatory requirements for medical products. With a highly skilled engineering team, Promex combines broad technical capabilities, advanced packaging and microelectronics assembly expertise with scalable manufacturing capacity to fast track new medical and bioscience products to volume production.

www.promex-ind.com

ASE Group
Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging and System-in-Package solutions to meet growth momentum across a broad range of end markets. For more about our advances in SiP, WLP, Fan Out, MEMS, Flip Chip, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com. To follow ASE on Twitter: @asegroup_global.

www.aseglobal.com

STATS ChipPAC is a leading service provider of semiconductor design, wafer bump, probe, packaging and test solutions for well-established markets such as communications, consumer and computing as well as emerging markets in automotive electronics, Internet of Things (IoT) and wearable devices. With an advanced technology portfolio and a global manufacturing presence spanning Singapore, South Korea, and China, STATS ChipPAC provides innovative integration solutions in wafer level packaging, flip chip interconnect and advanced System-in-Packages (SiP) to meet increasing market demand for higher performance, functionality and processing speeds with a significant reduction in space in an electronics device. STATS ChipPAC is a member of the JCET group of companies.

www.statschippac.com

ASE Group
Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging and System-in-Package solutions to meet growth momentum across a broad range of end markets. For more about our advances in SiP, WLP, Fan Out, MEMS, Flip Chip, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com. To follow ASE on Twitter: @asegroup_global.

www.aseglobal.com

Silex Microsystems is the world’s largest pure-play MEMS foundry enabling the world’s most innovative companies to participate in the sensory system revolution and commercialize MEMS technologies that are transforming the world.

MEMS development requires deep specialized knowledge and expertise as a new device goes from prototype to qualification to mass production. Silex is dedicated in brining customers quickly, cost-effectively and reliably through the product development lifecycle with:

• Expertise in rapid commercialization of MEMS products
• Pioneering innovation that delivers transformative MEMS manufacturing capabilities
• Responsive Collaborative partnering driven to enable customers’ success, from project inception to volume production
• Proven, stable, high-volume MEMS manufacturing capacity

www.silexmicrosystems.com

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