In the areas of both design and manufacturing, the industry is pushing the limits, even in technologies once thought to be mature. Wafer bumping, wire bonding, and surface mount technology, for example, are all very active topics in the research labs and manufacturing lines. On the design side, work continues in areas like system partitioning, materials, and design tool development. With all of this progress, the bridge that spans them – design for manufacturability (DFM) – has become more important than ever.
This year, for its annual industry update, MEPTEC is bringing together packaging experts in these critical areas and others to present detailed technical updates. Don’t miss your chance to get up to speed on today’s most important topics in packaging, all in one place on one day. The opportunity to learn is enhanced with MEPTEC’s unmatched Silicon Valley networking opportunities built into the day.
Wafer Fab, Packaging, and Test – Supply Chain Coordination as a Critical Capability
Session Leader: Phil Marcoux, FOA
Wafer fabs are expecting more from their package and test resources. IC packaging is continuing to be complicated, capital intensive, and unpredictable. The number of different package types marketed in the last ten years exceeds the number of different types deployed in the entire prior forty years of the semiconductor industry.
Due to pressures from the wafer device makers, semiconductor packaging is taking on features similar to the more capital intensive front-end wafer processing. This results in common challenges (and opportunities) for the entire semiconductor wafer, packaging, and test supply chain. The speakers in this session will help sort out the issues and suggest solutions where they can.
Pushing the Envelope on IC Package Manufacturing
Session Leader: Joel Camarda, SemiOps
This session will concentrate on leading-edge process technologies -- the non-proprietary capabilities and associated the process, equipment, and material details.
Wire bonding is declared to be obsolete at least every 10 years (via TAB, flip chip, wafer-level packaging, etc.), but it still remains the dominant interconnect. Beyond conventional gold and aluminum wire, we have seen copper wire, silver wire, insulated wire, longer wires, thinner wires, finer pitch bonding, multi-level bonding, and so on. How is this accomplished? Die bumping has also progressed consistently for many years with greater densities and process improvements. Solder bumps have yielded to finer pitched copper columns for many applications. What have been the key process enablers, and where is it headed? Substrate line, pitch, and via densities have also continued to advance. What are the key process enablers in materials and equipment?
Design Considerations for Advanced Package Development
Session Leader: John Xie, Altera
With the increased complexity of silicon in advanced process nodes, it is becoming more difficult to meet density, performance, and cost targets simultaneously. Optimizing the chip / package interface using the IC-PKG co-design concept is one of the critical processes in achieving product objectives. Meanwhile, IC-PKG co-design has also expanded beyond the chip / package interface -- it goes deeper into silicon layers and extends to the PCB and system. This industry-wide trend puts a high demand on EDA tools and features, new design flows, new concepts in product architectures, and the knowledge and skills of designers of ICs, packages, and PCBs. This session will include speakers who will discuss the latest developments in design from the EDA community, IC companies, and the packaging industry.
Enabling Multi-Die Packaging as a Mainstream Solution
Session Leader: Jeff Demmin, STATSChipPAC
Integration of more than one semiconductor device in a single package is nothing new. What used to be just a high-end approach, though – picture multi-chip modules from 20 years ago – is now a common solution in many applications from consumer electronics to servers. This range of applications creates a variety of challenges in design and manufacturing, including wafer thinning, stacking, interconnect, thermal management, and reliability.
This session will report on the latest technical developments that enable such configurations as processor / memory integration in mobile products, stacked memory, and RF modules.
• Ivor Barber, Xilinx
• Joel Camarda, SemiOps
• Jeff Demmin, STATS ChipPAC
• Nikhil Kelkar, Exar Corporation
• Phil Marcoux, FOA
• Rich Rice, ASE (U.S.) Inc.
• Jim Walker, Gartner
• John Xie, Altera Corp.
Exhibit spaces are limited. Exhibit fee include:
• 6’ table, draped
• 2 chairs
•11”x17” custom table top sign with your logo and company Ndescription
• One admission to the conference
• Logo on event home page
• Logo, link to your URL and company description on special
NExhibitor web page
• Company description in the symposium proceedings
• Printed and electronics versions of the symposium proceedings
• Marketing exposure through e-mail campaign
Sponsoring this event will provide a valuable opportunity to promote your company brand and product/service message to attendees, while supporting your business development and positioning goals. For benefits and pricing click on the Sponsorship Benefits link below. Click on the Sponsorship Application Form link below. For more information contact Bette Cooper at firstname.lastname@example.org or call 650-714-1570.
Cost of admission includes attendance, continental breakfast, refreshment breaks, lunch, and printed and online proceedings. A credit card is needed to hold the reservation.
Pre-registration is strongly recommended. There will be no guarantee of space or materials for on-site registrants.
Final confirmation including maps and directions will be sent by October 20.
Refunds for advance payment, less a $50 processing fee, will be given in full provided cancellation by phone or e-mail is received 10 business days before the event (Thursday, May 8). If you do not cancel by May 8 or are a no-show, the credit card provided to hold the reservation will be charged for the full amount.
MEPTEC has secured a special rate at the Biltmore Hotel of $199.00 from October 21 - October 23.
• Online: Group reservation link: Biltmore Reservations
• Call: 408-988-8411 or 1-800-255-9925 and mention Group Code
• 30036, or MEPTEC, to get the Group Rate.
Transforming Electronic Interconnect
Tim Olson, Founder & CTO, Deca Technologies
It begins and ends with us. As consumers, we’re creating a tidal wave of demand for all things portable and connected. We hold in our hands the force that shapes the global electronics industry with smartphones overtaking computers as the largest semiconductor end market.
The implications are significant. From unfamiliar terms such as SoC disintegration to the blurring of lines within the supply chain, we’ll examine the technology, capital and operational methods driving a transformation in electronic interconnect.
Spanning five orders of magnitude from 10’s of nanometers at the transistor level to 100’s of microns at the ball grid array (BGA) connections, electronic interconnect (EI) might best be characterized as the nervous system of an end appliance such as a smartphone. Within EI, traditional supply chain boundaries assign back end of line (BEOL) structures to the domain of wafer foundries operating in a range of 10’s of nanometers to 10’s of microns. First-level interconnect, or semiconductor packaging, is classically the purvey of semiconductor assembly and test service providers (SATS) working largely in the range of 10’s to 100’s of microns. Second-level interconnect, or classic board level assembly, is the responsibility of electronic manufacturing systems providers (EMS) who generally measure their work in 100’s of microns or larger dimensions.
A few of the highest growth areas within EI include wafer level chip scale packaging (WLCSP) and fan-out wafer level packaging (FO-WLP). These same technologies provide key building blocks for 2.5D and 3D architectures of the future while challenging traditional supply chain boundaries. For example, leading SATS have extended themselves into the domain of wafer fab processing while foundries have been extending their reach into the classic domain of SATs.
The transformation underway in electronic interconnect will redefine not only supply chain lines, but also the work of system architects, IC designers, packaging experts and many others in the years ahead.
Tim Olson is the founder and a board member of Deca Technologies. He served as Deca’s President and CEO for the first four years prior to transitioning to the role of Chief Technology Officer in 2013. Tim was previously Sr. Vice President of Research & Development and Emerging Technologies at Amkor when several breakthrough technologies were introduced including TMV™ PoP and FusionQuad™ (TMV™ & FusionQuad™ are trademarks of Amkor Technology). During his tenure at Amkor from 2003 to 2009, Tim also managed the leadframe products and advanced modules businesses.
As of 9/30/14
Listed alphabetically by last name
Optimize Product Cost and Performance with System-level 3D Chip, Package, Board Co-design
James Church, Solutions Architect, R&D Center, Zuken
The unique requirements of entry into new markets (automotive, wearable, IoT) is forcing companies to implement sophisticated package structures to realize the latest product platforms. To meet aggressive schedule and market requirements, engineering teams need to evolve from working in silos and within disconnected tool flows to new methodologies that enable them to collaborate across disciplines.
Using a system-level co-design approach in a 3D hierarchal design platform, engineers and architects are enabled to conduct path-finding studies and concurrent, detailed design of the chips, packages, and boards and access to analysis tools ensures designs are completed to meet electrical and physical and manufacturing specification. System-level co-design enables engineering teams to reduce time-to-market and product cost by eliminating frequent hand-offs in the design process and optimizing layer counts for RDL, interposer/substrates, packages, and PCBs.
Silver Sintering for Power Electronics
Jenny (Jiong) England, Principal Technical Service Engineer,
Henkel Electronic Materials
The drive to power electronics with the move to hybrid and electrical vehicles is pushing the industry to develop sustainable interconnection solutions for higher power and longer life time performance. The power modules operating temperatures are increasing from 150 to 200°C and possibly 250°C in the near future. Die attach interconnection by silver sintering is one of the most considered solution to meet the high temperature and long life time requirements. The presentation will discuss the current state of the art silver sintering technology and its performance under passive and active cycling conditions.
An IDM’s Integration and Partnership with the OSAT Supply Chain
James G. Gandenberger, Vice President of Worldwide Operations
& Foundry Business Unit, Micrel, Inc.
Micrel, Inc. is a leading global manufacturer of IC solutions for the worldwide high performance linear, power, LAN, timing, and communications markets. The Company has its own wafer fabrication facility in San Jose CA., which also provides foundry services, including servicing the MEMS foundry customers. Currently, Micrel has more than 10,000 products, and ships in excess of 1 billion units annually. With its own domestic fab, Micrel has become unique in a market that has become increasingly fabless; these driving forces will be discussed. Micrel integrates its operations with a predominantly Asian OSAT supply chain, and with over 130 package types and multiple test platforms, this necessitates several suppliers. The Operations team applies best practices, but a difficult-to-predict market continues to push the limits. Rigorous performance criteria must be maintained with respect to cost, quality, cycle times, on time delivery. These topics, and the criteria for supplier partnerships and ongoing relationships, will be discussed.
Thermal Management in High-Performance Integrated 3D TSV Logic/Memory Systems
Tom Gregorich, Vice President of Package Technology, Micron
Thermal management in high-performance electronic systems can be a significant challenge by itself. However, the integration of memory and 3D TSV structures with these high-performance systems can significantly complicate the required thermal solutions. Compared to monolithic die, thermal impedance will increase with 3D TSV stacks and proximity to high-powered logic will increase the thermal coupling.
In this presentation we will explain the difference in thermal impedance between monolithic die and stacked die cubes, and will explore how 3D memory stacks might perform in 5 different types of logic/memory systems, including discrete, semi-discrete, semi-integrated, integrated and vertically stacked.
Considerations in High-Speed High Performance Die-Package-Board Co-Design
Jenny Jiang, Principal Engineer of SIPI, Altera Corporation
This talk addresses various challenges and considerations associated with high-speed serial link design. As data rates increase, the importance of assessing overall channel performance grows. Silicon-package-board co-design considers both frequency and time domain budgets. It is essential for robust implementation. The effective co-design helps accommodate anticipated channel degradation and achieve time-to-market goals. This talk focuses on channel loss, material dispersion, cross talk and supply noise analysis in high speed serial link, and their contributions to system jitter degradation, which is a significant factor in the design of almost all communications links such as PCI Express, Ethernet, XAUI, Interlaken, etc.
Challenges of Building RF Multi-chip Modules
Frank Juskey, Senior Member of the Technical Staff, Advanced Technology Development Group, TriQuint Semiconductor
The popularity of smart cell phones has propelled the development of multi-chip modules for RF applications to the forefront of technology development. Along with this development many problems have occurred requiring new and innovate solutions. A few of these innovations have allowed the industry to drive cost reducing strategies that beforehand were just not possible. One of these strategies was the use of flip chip die attach to replace the more common die attach and wire bond process. I will discuss how the development of low cost pillar bumping and the development of the 01005 passive SMT components drove the development of SMT chip placement equipment. The accuracy and precision needed to place these very small SMT components also allowed the use of the same equipment to place flip chip die at an order of magnitude greater speed than conventional die placement systems, resulting in a lower manufacturing cost.
MCM Package Development for In-Vehicle Infotainment System
Terry Kang, Sr. Packaging Development Manager, NVIDIA
In-vehicle infotainment is a collection of hardware devices to provide audio, visual entertainment and automotive navigation system. In the last decade, In-vehicle infotainment system has become one of the key driving technologies in automobiles. NVIDIA has developed MCM (Multi-Chip-Module) packages for infotainment system. This paper presents the key features of MCM package that NVIDIA has developed, and technical challenges and solutions encountered in the phase of package design, material and assembly process development. Package reliability test conditions for automotive and reliability results are also illustrated in this paper.
Supply Chain Benchmarking Now Focused on Packaging
Ariel Meyuhas, COO, The MAX Group
We all know that the semiconductor supply chain is becoming more and more intertwined. The Fab Owners Association (FOA) represents executives responsible for the manufacture of semiconductor devices from the bare silicon through to the shipment of the final product to the customer, so the smooth functioning of the supply chain is a top priority for us.
Increasingly, the Fab Owners are as concerned about packaging and test as they are with other parts of the supply chain. The MAX Group has been the primary benchmark administrator for the front-end processes for the past seven years as part of the FOA and Sematech. At the request of a number of FOA members, this year marks the first year in which packaging and test have been added and are a primary focus of our benchmarking work.
This presentation will review the methodology and tools employed to conduct such a benchmark, as well as the type of information the device makers are seeking. One key goal of this presentation is to invite participation by the members of the packaging and test community, such as the OSATs, equipment makers, material suppliers, design/analysis software providers, etc., to help refine and add to the benchmarking effort so it becomes a relevant and beneficial study for the industry. All parties have a mutual interest in making this effort successful – the future of the industry depends on it.
The Future of Packaging - The Relevance of Wire Bonding
Ivy Qin, Process Director, Kulicke & Soffa Industries, Inc.
Advancements in electronic packaging performance and cost have historically been driven by higher integration primarily provided by wafer FAB node shrinks that have followed the well-known Moore’s law. However, the tremendously increasing cost of building new FABs will soon cause the performance/cost improvements achieved by moving to smaller technology nodes to become negative. This has initiated the idea of More-than-Moore and vigorous R&D for greater performance through packaging. Substantial performance improvements have been realized through wire bonded packages such as multi-tier packages, stacked die and stacked package-on-package technologies. On the cost side, the recent revolution in the use of copper wire bonding to replace gold has significantly reduced packaging costs. The most recent advances in wire bonding has improved fine pitch Cu wire bonding capability dramatically so that today’s advanced technology devices such as 28nm and 20nm nodes are being bonded with Cu wire. Some of the key advances in wire bonding to enable advanced node bonding including the advanced Cu bonding processes, oxygen free insert gas system, advances in bonding wire and molding compound and tighter production control.
Will IoT (Internet of Things) drive 2.5/3D IC revenue growth and change our lives?
Herb Reiter, Founder, eda2asic Consulting, Inc.
Forecasts for 50 Billion IoT devices by 2020 have captured the semiconductor industry's attention.
While a very broad range of possible IoT applications appears likely, very few specific technical requirements have been defined and agreed upon yet - except: 1) Security and privacy will be mandatory for IoT's success, and 2) Many heterogeneous functions (logic, memory, analog/RF, MEMS,..) will need to be combined, and 3) Low cost, low power and small form-factors will be key differentiators determining success.
The speaker will outline IoT market development, forecasts and expert opinions as well as ongoing intra- and inter-company efforts for more efficient communication and cooperation between humans and machines and project which impact this IoT trend will have on 2.5/3D IC revenues and, most importantly, on our work lives and leisure times.
Morphing the Semiconductor Outsourcing’s Business Model: Wafer Level Packaging
Jim Walker, Research Vice President of the Semiconductor Manufacturing and Emerging Technologies Group, Gartner
To date, the packaging realm has mostly been the leader in the use of the vertical dimension to produce the “Moore than Moore” result. Die and package stacking, multichip packages, wafer bumping and redistribution have become mainstream technologies to reduce size and form factor, while providing improved speed and performance. However, as leading edge packaging processes continue to become more wafer-like in nature, the overlap with foundry processes has become quite muddled and somewhat competitive. Have the limits on packaging been reached? Should it really now be done as part of wafer fab? Or, will packaging technologies continue to provide the cost-effective solutions that it has done for the past 50 years? These questions and more will be addressed, as in-the-end, it will be the customer who really decides the answers.
Others to be announced