Technical innovations in design, process, materials, packaging and test have enabled widespread commercialization of breakthrough MEMS products. MEMS sensing applications will track growth in mobile, industrial, consumer and biomedical markets, enabled by innovations in functional sophistication, cost-reduction, and productivity.
MEMS productivity gains arise primarily from Design, Process, Packaging and Test. The convergence of Design innovations, Process technologies, Packaging advances, and development of low cost Test technologies each plays a major role for wide scale adoption of breakthrough MEMS enabled products. Design offers greater sophistication of sensor function, specificity and sensitivity. Process advances enable previously impossible constructions. Packaging innovations provide complete solutions, more features in incredibly compact formats. Test improvements inspire trust and lower cost sensors. Integration of these elements is critical to meeting price points that catalyze volume growth and massive new market penetration.
This conference will showcase these technologies that form the basis for advancements in MEMS products, to achieve future capabilities, enabled by innovations unthinkable a decade ago.
• Gene Burk, IMT
• Sean Cahill, Maxim Integrated Products
• Ira Feldman, Feldman Engineering
• MaryAnn Maher, SoftMEMS
• Mark Wendman
The cost to exhibit is $645.00 for MEPTEC and MEMS Industry Group members, and $745.00 for non-members and includes:
• One admission to the conference
• 6’ table, draped
• 2 chairs
•11”x17” custom table top sign with your logo and company Ndescription
• Logo, link to your URL and company description on special
• Company description in the symposium proceedings
• Printed and electronics versions of the symposium proceedings
• Marketing exposure through e-mail campaign
Sponsoring this event will provide a valuable opportunity to promote your company brand and product/service message to attendees, while supporting your business development and positioning goals. For benefits and pricing click on the Sponsorship Benefits link below. Click on the Sponsorship Application Form link below to sign up. For more information contact Bette Cooper at firstname.lastname@example.org or call 650-714-1570.
Pricing for general admission is $495.00 for MEPTEC and MEMS Industry Group members and $595.00 for non-members and includes attendance, continental breakfast, refreshment breaks, lunch, and printed proceedings. A credit card is needed to hold the reservation.
Pre-registration is strongly recommended. There will be no guarantee of space or materials for on-site registrants.
Final confirmation including maps and directions will be sent before May 16.
Refunds for advance payment, less a $50 processing fee, will be given in full provided cancellation by phone or e-mail is received 10 business days before the event (Thursday, May 8). If you do not cancel by May 8 or are a no-show, the credit card provided to hold the reservation will be charged for the full amount.
A block of rooms has been reserved at the San Jose Holiday Inn (formerly the Wyndham Hotel) for a rate of $149.00. The hotel is conveniently located at 1350 North First Street, San Jose, CA in close proximity to the San Jose Airport. To reserve online click here - the Group Code box already has the MEPTEC code, MTC. Enter dates between May 20 and May 24; the $149 rate will automatically come up. You can also call 408-453-6200 to reserve your room; be sure to mention MEPTEC in order to secure the special rate.
MEMS Design Innovations
MEMS product development often involves the co-design of MEMS devices, associated electronics, custom packaging and new fabrication processes requiring collaboration between domain experts--the “one product, one process, one package” dilemma. This session will focus on design for manufacturable MEMS based products and new trends in their design including design re-use and semi-custom design as well as new design techniques in fully custom designs. The increasing importance of system level design and software for MEMS-based products will also be highlighted.
The Changing Landscape of MEMS Manufacturing and Process Technologies
MEMS product development has often involved creation of new fabrication processes, fabrication sequences, and the use of new materials. Equipment manufacturers are providing new MEMS-specific equipment with enhanced capabilities and new materials are being utilized to enhance MEMS performance. In addition, traditional MEMS fabrication processes are being combined with new technologies such as 3D printing, meso-scale fabrication techniques, and nanotechnologies creating both great opportunities and great challenges for getting products to market in a timely, cost effective manner. This session will provide a look at the changing landscape of MEMS manufacturing and process development in the context of the “manufacturing renaissance” happening worldwide.
MEMS Packaging – Impact on Devices and Volumes
Electronics packages typically allow electrical connection while allowing the devices contained within to remain as isolated as possible from their environs. MEMS devices must interact with their surroundings, they are often subjected to direct contact with the environment, and usually must sense a particular variable without contamination from other potentially interfering inputs. Packages need to allow appropriate interaction with the measurand of interest, connect to power and signal I/Os, provide some isolation from undesired inputs, and create a test interface. The ideal package does all of the above and costs almost nothing. Low cost is achieved largely by exploiting existing high-volume technologies to the extent possible.
From another viewpoint, MEMS approaches have informed packaging efforts of traditional electronics. Stress isolation, deep trenching, wafer stacking, thermo-mechanical management techniques, and 2.5D and 3D package approaches have borrowed from the MEMS playbook.
This session will include speakers with insights into packaging of MEMS and the impact of MEMS on devices and their packaging at volume.
MEMS Device Testing Challenges
Testing of MEMS has been a traditional challenge as compared to CMOS devices. The need to measure a major physical input while eliminating minor inputs over temperature and with varying performance parameters has made this aspect of MEMS device production costly and difficult. The design of test systems follows closely the “one product, one test protocol, one test system” paradigm that is developed by the product company. Our speakers will address some of the issues and solutions that have been used in testing devices and which could be used in creating standardized testing of MEMS devices for high volume low cost applications in the future.
Several converging trends are transforming the entrepreneurial process for starting MEMS companies and transitioning MEMS devices into production and into the market. First, it is well-known that recent market set-backs have caused traditional VC funds to view any hardware start-ups with renewed scrutiny and skepticism. Hardware start-ups typically require large amounts of capital ($50-$100M) and many years (7-10), before getting close to a reasonable exit. This large investment in money and time is on top of the already inherently risky prospects for such a start-up being commercially successful. Secondly, MEMS is recognized, by investors, by foundries, and by large consumer electronics companies, as a very successful new product area because of the huge up-take of MEMS components in mobile devices during recent years. Third, key strategic issues in huge upcoming new consumer markets, such as wearables and IoT, are sensors and contextual awareness; areas which are uniquely solved by MEMS devices. And fourth, the sheer number of successful, high volume MEMS devices currently on the market, has created a huge pool of skilled MEMS developers and manufacturers which can be drawn upon for new devices and new start-up companies. All these factors dramatically influence how such companies get funding and how they operate. We will discuss all these issues as they relate specifically to new MEMS companies.
Kurt Petersen received his BS degree cum laude in EE from UC Berkeley in 1970. In 1975, he received a PhD in EE from the Massachusetts Institute of Technology. Dr. Petersen established a micromachining research group at IBM from 1975 to 1982, during which he wrote the review paper “Silicon as a Mechanical Material,” published in the IEEE Proceedings (May 1982). This paper is still the most frequently referenced work in the field of micromachining and micro-electro-mechanical systems (MEMS).
Since 1982, Dr. Petersen has co-founded six successful companies in MEMS technology, Transensory Devices Inc. in 1982, NovaSensor in 1985 (now owned by GE), Cepheid in 1996 (now a public company on NASDAQ: CPHD), SiTime in 2004 (still private), Profusa in 2008 (still private), and Verreon in 2009 (acquired by Qualcomm).
In 2011, Dr. Petersen joined the Band of Angels in Silicon Valley. The Band is an angel investment group which mentors and invests in early stage, high-tech, start-up companies. Today, he spends most of his time helping and mentoring such companies.
Dr. Petersen has published over 100 papers, and has been granted over 35 patents in the field of MEMS. In 2001 he was awarded the IEEE Simon Ramo Medal for his contributions to MEMS. Dr. Petersen is a member of the National Academy of Engineering and is a Life Fellow of the IEEE in recognition of his contributions to “the commercialization of MEMS technology”.