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A variety of MEMS and sensor devices for aerospace applications have been developed over the years and miniaturization continues to be an important driver for further development. This workshop will address various aerospace MEMS and sensor technologies, their principles of operation, typical applications and system interfaces.
Covered topics will include:
• MEMS for aerospace guidance and navigation
• MEMS in aerospace communications
• MEMS packaging for aerospace applications
• Micropropulsion technologies
• Tactical and inertial grade MEMS navigation sensors
• Test and reliability for aerospace MEMS
• Materials innovations for aerospace MEMS
• MEMS for aerospace instrumentation
• Analog and digital flight control systems
• Sensors for fly-by-wire systems
• Sensors for aerospace weapon systems
• Aerospace pressure sensors
• Guidance and navigation sensors
• Aerospace humidity sensors
• Vibration sensors for aerospace applications
• Sensors for aerospace engine control
• Tactical and inertial grade navigation sensors
Wireless Sensing for High Temperature Aerospace Applications
Ertugrul Berkcan, Principal Scientist, GE Global Research Micro & Nano Structures
The turbine environment is well known to be an exceedingly harsh environment for sensing and wireless sensing. On the other hand, there are substantial advantages to be gained from the development of these sensors for such harsh high temperature environments. This presentation will overview the GE Global Research investigations and developments in high temperature, harsh environment sensing areas. In particular, we present a self-gauging overview of the possible approaches to the wireless sensors for these applications. These approaches depend on and are delineated by the temperature ranges, availability of power (harvesting) or its passive modes, and the frequency/physical layer characteristics.
About the Speaker
Ertugrul is a principal scientist at GE Global Research where he joined in 1986; since then, he has been carrying out research and development of MEMS, sensors, sensor-electronics interface, and sensor system architecture. His current research interests lie in wireless harsh environment sensors & systems, mircoelectromechanical systems and devices, remotely powered wireless sensors, and passive energy coupled sensors,. His research has included the areas of MEMS sensors and actuators, low cost high accuracy sensors, current and magnetic field sensing, sensors for smart appliances, smart networked sensors for automation, and low cost diagnostic sensor systems, wireless and self-powered sensor platforms, high capacity, low latency control/monitoring, and microprognostic system development for structural health monitoring. Ertugrul has authored more than 40 papers and has been awarded more than 85 patents.
Pushing MEMS Accelerometers to their Limits for Aerospace Applications
Bertrand Dutoit, Group Leader, Inertial Navigation Developments, Colibrys
MEMS Accelerometers are well known in automotive and consumer applications. Price, size and power consumption are among the critical specifications for such applications. On the high-end side of the market critical specifications are very different: stability is the most important parameter. This means that all parameters must stay as they were at the final production test. This does not only include short term stability like warm-up, but also environmental effect due to vibrations, shocks or temperature harassing.
Recent progresses in high-end MEMS accelerometers have the potential to open new applications in mid-accuracy navigation. In this presentation, we propose a comprehensive review of typical accelerometer requirements for aerospace applications. The importance of the main specifications will be explained and compared with the actual state of the art in this field.
About the Speaker
Bertrand Dutoit has 13 years of expertise in the development of micromachined sensors, especially accelerometers, gyroscope and pressure sensors. After his PhD in microsystem design, he has lead several projects at Colibrys resulting in three different accelerometer commercial products lines dedicated for Aerospace/defence applications.
Micromachined Deformable MEMS Mirrors in Aerospace Applications
Steven Cornelissen, Vice President Engineering, Boston Micromachines Corporation
Micromachined deformable MEMS mirrors have enabled rapid advances in the aerospace arena including large telescope astronomy and optical communications such as long-range free space, and covert low power applications over the last decade. This talk will describe the work at Boston Micromachines Corporation to design, fabricate, and control MOEMS deformable MEMS mirrors for adaptive optics and communications. Integration of the deformable mirrors in adaptive optics is described, along with results demonstrating unprecedented advances in resolution and control in imaging studies challenged by unavoidable wavefront aberrations. Communications advances will also be included. Deformable MEMS mirror research offers an economical and reliable technology to enhance capability over the state-of-the-art.
About the Speaker
Steven Cornelissen is Vice President of Engineering at Boston Micromachines Corporation of Cambridge, Massachusetts. Mr. Cornelissen received his B.S. degree in mechanical engineering from San Jose State University, and M.S. degree in mechanical engineering from Boston University and has been active in research and development work focusing on design and fabrication of optical MEMS devices for wavefront control for the past ten years. His research and product development efforts have led to novel optical MEMS devices and commercial MEMS DM systems.
MEMS Sensor Technology: Driven and Refined for Demanding Aerospace Applications
Joseph Mallon, CEO axept/Researcher, Stanford University
As micromachined (later MEMS) silicon sensor technology evolved, starting in 1960’s and accelerating in recent years, it has in substantial part, been driven by the needs of aerospace applications. Modern aerospace systems demand small, reliable, sophisticated, self-diagnostic sensors. Such sensors are often subjected to shock and vibration, temperature and radiation requirements that exceed the needs of many earth bound applications. Silicon sensors, because of the inherent physical properties of silicon, and especially because of the decades of process refinement in mainstream IC’s, are uniquely positioned to address those needs. Early silicon MEMS piezoresistive sensors made possible the development of modern jet fighters and advanced weapons systems. Today, silicon MEMS sensors will be found in the most demanding applications, from the space shuttle to satellites, from smart weapons systems to commercial aircraft, from air data systems to autopilots and inertial guidance systems. This presentation discusses the evolution of silicon sensors in aerospace, focusing on the key characteristics, and successful applications that have driven the technology.
About the Speaker
Joseph Mallon is CEO of axept, a manufacturer of MEMS-based, sensors and systems. Previously, CEO and Chairman of Measurement Specialties, a publicly traded public MEMS sensor company. In 1985, with Janusz Bryzek, and Kurt Petersen, he co-founded NovaSensor (now GE NovaSensor, where was Co-President and Director. Earlier, he was Engineering Vice President at Kulite Semiconductor Products, where along with the Founder Anthony Kurtz, he pioneered MEMS piezoresistive pressure sensors and accelerometers. Holds a B.S. in Science, cum laude, from Fairleigh Dickinson University, and an M.B.A. from California State University. He currently is pursuing a Ph.D. in mechanical engineering at Stanford University. He has published over sixty papers, and was awarded forty-five U.S. patents. In 2000, he was named small-cap-company CEO of the year by Red Chip Review. At COMS 2004 he was recognized as a pioneer in piezoresistive and MEMS sensors.
Ceramic Packaging for Aerospace MEMS
Adam Schubring, Senior Market Development Engineer, Kyocera America
Aerospace MEMS often require operation under harsh environmental conditions. Aerospace MEMS packages need to survive high temperature variances and high vibration while providing the MEMS device a mechanically stable platform within a hermetic package. This presentation will discuss packaging strategies offered by multilayer high temperature co-fired ceramic and the flexibility offered to the MEMS package designer that cannot be offered by other technologies. The presentation will also illustrate how ceramic packages continue to evolve with the miniaturization demands of the MEMS industry.
About the Speaker
Adam Schubring is a Senior Market Development Engineer for Kyocera America, where he focuses on application engineering and new product development for ceramic packaging of MEMS devices for automotive, aerospace, and consumer applications. Prior to Kyocera, he has held positions at Delphi-Delco in Kokomo, Indiana, where he was responsible for thick-film material development, and also at Visteon Corporation, in Dearborn, Michigan, where he developed multi-layer ceramic controllers for engines and transmissions. He has his bachelor's and master's degrees from the University of Michigan - Ann Arbor, in Materials Science and Engineering.
Reliable MEMS Vacuum Packaging for Aerospace Applications
Doug Sparks, President, NanoGetters
A number of MEMS devices have been applied to aerospace applications. Improved vacuum packaging methods have been employed to improve the reliability and performance of MEMS-based gyroscopes, accelerometers, pressure sensors, RF-resonators and fuel quality sensors. Thin-film getters are a relatively new development that has been applied to this field both at the chip and ceramic or metal package level. This type of wafer-level packaging technology has also been utilized in new microfluidic devices which are being used to insure high aviation fuel quality. These packaging methods and applications will be discussed with respect to the aerospace industry.
About the Speaker
Doug Sparks is the President of NanoGetters and Executive Vice President at Integrated Sensing Systems Inc (ISSYS). NanoGetters provides vacuum packaging services to the MEMS community and is AS9102 qualified for the aerospace industry. At ISSYS Doug directs the microfluidic product line, developing and producing density meters and Coriolis mass flow sensors. Prior to joining ISSYS he worked at Delphi’s Delco Electronics Division for 17 years in the area of MEMS and integrated circuits for automotive and aerospace applications. Doug has also been with Cincinnati Milacron’s Semiconductor Materials Division and the Turner Electroceramics Laboratory. He has published over 100 technical papers, has over 30 patents and holds a Ph.D. in material science and engineering from Purdue University.
Managing Risk at the MEMS and Electronics Interface in Aerospace Applications
Ken Stern, Mixed-Signal and Analog ASIC Manager, Intrinsix Corp.
MEMS sensors of all kinds are constructed so that the physical structure and the material properties combine to achieve sensitivity to a target physical stimulus. The response of this physics package must always be translated into a usable signal by the companion electronics. In many sensor topologies, the electronics has the additional job of stimulating the physics package (i.e. resonating a MEMS gyro). Significant risk arises at the MEMS-electronics interface in direct correlation to other dynamics there, as signals and assumptions travel between devices, design teams, and even across corporate boundaries. The harsh environments in typical aerospace and defense applications can dramatically compound the challenges. This presentation will review these issues as seen and solved by Intrinsix across a range of commercial and defense/aerospace MEMS types, discuss systematic approaches to minimizing risk at the interface, and recommend best practices for achieving the highest performance with first-pass success. Some topics to be addressed include co-simulation and full system approaches to verification.
About the Speaker
At Intrinsix Corp., Ken manages the development of companion electronics for a range of MEMS and sensor devices. Prior to Intrinsix, Ken consulted to Analog Devices for 14 years, and has worked at Crystal Semiconductor, Bell Labs, and ITEK-OSD, where he participated in an early MEMS adaptive optics system. Ken holds an MBA from Wharton, an MSEE from Caltech, and a BS-Bioengineering from the University of Pennsylvania. Intrinsix provides mixed-signal and digital integrated circuit designs for the Aerospace-Defense and the expanding MEMS markets including companion electronics for accelerometers, controllable mirrors, MEMS-based mass memory, inertial guidance, space infrared sensors, magnetic sensors, and DNA-based biosensors.
Effects of Vibration on MEMS Inertial Sensors for Aerospace Applications
Mike Sutton, Senior Product Design Engineer, Honeywell Aerospace
Aerospace applications of MEMS inertial sensors require high performance through often severe vibration environments – jet engine vibration, rocket motor ignition, explosive bolts, etc. Unfortunately, MEMS inertial sensors can be particularly sensitive to external vibrations due to factors such as high quality factors (Q), non-idealities in sense and control electronics, imperfections in the sensors, just to name a few. This talk will first discuss vibration effects in MEMS gyros and accelerometers including proofmasses coming into contact with caging features, electrostatic snap-down, and vibration rectification error (VRE) mechanisms. Methods to analyze vibration such a shock response spectrum (SRS) as applied to the specifics of MEMS sensors and high level system models will be presented. Finally, various methods to mitigate the effects of vibration will be discussed, including methods to reduce Q of sensors (e.g. gas damping, electronically modifying spring constants, etc.) and other system level modifications and compensations that can be applied.
About the Speaker
Mike Sutton is a Senior Product Design Engineer for Honeywell Aerospace working on both MEMS rate sensors and accelerometers. He received his Master’s of Science in Electrical Engineering from the University of Minnesota where he worked on MEMS bolometers and MEMS coatings to make thermally invariant structures.
MEMS Accelerometers and Gyroscopes in Spacecraft
Benedikt Zeyen, Ph.D., Associate, A.M. Fitzgerald & Associates, LLC
Accelerometers and gyroscopes are considered to be the most mature MEMS devices used in space today, with several missions already flown. This review will highlight examples of their use in previous space missions, and will compare their sensitivity and stability performance against requirements of typical space missions. With the rapid improvement of performance values in today’s MEMS inertial sensors, it is expected that these sensors will rapidly find more and more applications in space.
About the Speaker
Dr. Zeyen is an Associate with A.M. Fitzgerald & Associates, Burlingame, CA. He has a strong background in MEMS product development, design for manufacturing, and static/dynamic modeling of complex systems. He develops and optimizes mass producible fabrication processes, explores and optimizes device performances using multiphysics finite elements, and conducts simulation and experiment driven failure analyses for his clients. Dr. Zeyen has been previously employed by the European Space Agency and EADS Space Transportation. He received his Diplom- Ingenieur degree in Mechanical and Aerospace Engineering from the Technical University of Munich, Germany, and his Ph.D. in Mechanical Engineering from the University of California, Santa Barbara.
Others to be announced.
The MEMS Investor Journal and MEPTEC are offering sponsorship opportunities for the MEMS and Sensors for Aerospace Applications 2010 workshop. The sponsorship will provide the company with many benefits not only at the workshop itself, but will also include marketing promotions throughout the year such as targeted e-mail blasts, and banner and print advertising, among others.
Click button for PDF containing information and pricing.
Guaranteed registration will be accepted by mail, fax, phone or e-mail. Space is available on a first come, first served basis. Pre-registering and pre-paying will guarantee you admission, proceedings materials and lunch. Please note that you may pay at door for attendance, but you must hold your registration with a credit card. There will be an additional $25.00 fee to register at door on the day of the event without a pre-paid or held reservation.
Refunds for advance payment will be given in full provided cancellation is received 72 hours prior to the event (by end of day Wednesday, April 14). If you chose to pay at the door but do not show and do not cancel 72 hours in advance, the credit card you provide to hold the reservation will be charged.
PLEASE REGISTER BY APRIL 16.
Registration confirmation, location map and other information will be sent to you.
A block of rooms are being held as space is available at the Biltmore Hotel for a rate of $79.00. The hotel is conveniently located at 2151 Laurelwood Road in close proximity to the San Jose Airport. Call 408-452-0200 or 800-255-9925 to reserve your room. Be sure to mention MEPTEC in order to secure your special rate.
MEMS Investor Journal is the only independent publication devoted to providing comprehensive coverage of the latest developments in the rapidly emerging MEMS industry. Our weekly newsletter is specifically designed for MEMS industry professionals and reports on the top MEMS stories from 7000+ sources worldwide. We cover the most critical developments in the MEMS industry to ensure that our subscribers explore and take advantage of the latest investment, commercialization and partnership opportunities. Our newsletter also reports on the most vital newly granted patents in the MEMS industry. Benefits and features include: comprehensive MEMS news coverage, 7-14 MEMS and microsystems news stories every week, interviews with MEMS industry leaders, latest MEMS patents and patent applications, sample chapters from newly published MEMS books, MEMS classifieds including job posts and equipment, latest MEMS whitepapers and presentations, MEMS CDs, catalogs and vendor literature. For more information about MEMS Investor Journal visit www.memsinvestorjournal.com.
MEPTEC (MicroElectronics Packaging and Test Engineering Council) is a trade association of semiconductor suppliers, manufacturers, and vendors concerned exclusively with packaging, assembly, and testing, and are committed to enhancing the competitiveness of the back-end portion of the semiconductor industry. Since its inception 30 years ago, MEPTEC has provided a forum for semiconductor packaging and test professionals to learn and exchange ideas that relate to packaging, assembly, test and handling. Through our monthly luncheons, and one-day symposiums, and an Advisory Board consisting of individuals from all segments of the semiconductor industry, MEPTEC continuously strives to improve and elevate the roles of assembly and test professionals in the industry. For more information about MEPTEC visit www.meptec.org.
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MEMS Investor Journal
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