AGENDAbutton
item10
HOME
SPEAKER BIOS
SPONSORS & EXHIBITORS
VENUE & ACCOMMODATIONS
SPONSORSHIPS & EXHIBITING
CONTACT US
item24
ABSTRACTS
SYMPOSIUM CO-CHAIRS

Resources/2017%20Q4%20Slide%201_slide_moo-ss_item1153_46_moo1-1p3_.jpgResources/2017%20Q4%20Slide%201_tn_moo-ss_item1129_79_moo1-1p3_.jpg

Resources/2017%20Q4%20Slide%202_slide_moo-ss_item1115_81_moo1-1p3_.jpgResources/2017%20Q4%20Slide%202_tn_moo-ss_item1185_14_moo1-1p3_.jpg

Resources/2017%20Q4%20Slide%203_slide_moo-ss_item1163_96_moo1-1p3_.jpgResources/2017%20Q4%20Slide%203_tn_moo-ss_item1152_81_moo1-1p3_.jpg

Resources/2017%20Q4%20Slide%204_slide_moo-ss_item1195_87_moo1-1p3_.jpgResources/2017%20Q4%20Slide%204_tn_moo-ss_item1177_73_moo1-1p3_.jpg

As the growing need to integrate disparate semiconductor technologies in a cost effective way with rapid cycle time and the driving demands of our increasingly connected world, we find many key hurdles in mainstreaming heterogeneous technology packaging solutions. In particular, this event will explore three issues central to the successful execution of heterogeneous integrated packages:

• Can the packaging community establish a real design for heterogeneous integrated ecosystem?

• Should we rethink the reliability standards for these heterogeneous integrated SIP packages?

• What are the best test strategies for these heterogeneous integrations, or at least what are
the guiding principles?

The program will include three keynote presentations from industry experts outlining these three issues in more detail, each followed by an interactive panel discussion on these same topics. The panels will be populated with industry experts with diverse and perhaps conflicting views on these important topics.

Be sure to join for what promises to be an exciting and educational day as we debate the issues central to successful heterogeneous integration implementation!

READ MORE ABOUT THE PANELS

VENUE & ACCOMMODATIONS ABSTRACTS