As the growing need to integrate disparate semiconductor technologies in a cost effective way with rapid cycle time and the driving demands of our increasingly connected world, we find many key hurdles in mainstreaming heterogeneous technology packaging solutions. In particular, this event will explore three issues central to the successful execution of heterogeneous integrated packages:
• Can the packaging community establish a real co-design and simulation ecosystem to enable
• heterogeneous integration with cost and time to address the consumer dominated markets?
• Should we rethink the reliability standards for these heterogeneous integrated SIP packages?
• What are the best test strategies for these heterogeneous integrations, or at least what are
• the guiding principles?
The program will include three keynote presentations from industry experts outlining these three issues in more detail, each followed by an interactive panel discussions on these same topics. The panels will be populated with industry experts with diverse and perhaps conflicting views on these important topics.
Be sure to join for what promises to be an exciting and educational day as we debate the issues central to successful heterogeneous integration implementation!