Sensing in the City of Things
John Baekelmans, Managing Director & Vice President, imec NL

Through its ‘City of Things’ (CoT) initiative – in collaboration with the City of Antwerp in Belgium – imec paves the way for the creation of tomorrow’s smart cities. City of Things is a large-scale testing ground – covering a surface of 80 square kilometers – that will enable thousands of Antwerp citizens and visitors to communicate (and interact) with a huge number of smart devices and sensors. Being the largest smart city living lab in Europe, it provides tech entrepreneurs with a unique opportunity to get in touch with users who can help them develop, test and optimize future products and services.

In this keynote, John will give a City of Things overview, describe the need for a living lab approach within smart cities, explain the quadruple helix, dig into the use-cases and unravel the sensing needs and solutions provided in detail.

Sensorizing and Connecting Medical Devices
Cory Forbes, CTO of Nypro, A Jabil Company

The digital revolution is upon us and Connected Devices are becoming ubiquitous. Integrating the hardware into evolving product form factors and streamlining the data collection and the analytics layers of the IoT ecosystem across different domains (smart retail, hospitality, healthcare, safety, etc.) can help enhance the ROI of the solution. A complete IOT ecosystem consists of Users, Organizations, Devices, Sensors, Gateways, Data and Analytics wrapped in a seamless user experience. The success of such an ecosystem depends on innovative and intelligent integration of these components and effective deployment driving meaningful output. Some examples of such integration are discussed in this presentation to provide a window into the opportunities to integrate sensors into previously passive or non-sensorized devices. While there are several subsystem components the presentation outlines opportunities and challenges for enabling electronics integration leveraging current and future technologies supporting digitization of healthcare devices and enhancing related services.

Connecting the dots on the Internet of Things – is your organization ready?
Len Sheynblat, VP Engineering at QUALCOMM, Qualcomm

Wikipedia defines Internet of Things as an internetworking of connected smart physical devices “embedded with electronics, software, sensors, actuators, and network connectivity that enable these objects to collect and exchange data”. Essentially what makes these devices smart is the data collected and exchanged. How do we ensure that this data is useful and addresses the real-world problems? For instance, according to the Pipeline and Hazardous Materials Safety Administration only 5 percent of the nation’s pipeline spills are detected by remote sensors. It is commonly accepted that there is a need to provide the means for the data to be collected, means to process this data and means to act upon the insights derived from the data processing step. But how do we converge on the wireless connectivity options, protocols, frameworks, interoperability, security, privacy, data management and ownership? And perhaps more importantly how well is your organization positioned to monetize on the projected $375B IOE ICT spend in 2020? While this keynote will not provide all the answers, hopefully, it will bring up some important questions to be pondered by the industry and your organization.

Sensors in Package – The New Challenges and Solutions for MEMS and Sensor Packaging
Adrian Arcedera, Vice President, MEMS & Sensors, Amkor Technology

Many leading companies and industry experts predict that the growing trend for smart devices (smart cars, smart cities, smart factories and more) will result in the deployment of a trillion sensors, many of which will use MEMS technology. However, MEMS and Sensor devices continue to evolve in different paths through creative wafer fabrication techniques as compared to standard integrated circuits.

At the onset of MEMS packaging, priority was given to solving the end-market application over cost and package form factor. This created a broad diversity of package form factors, with a different approach for almost every application and end market. As the MEMS market grows and transitions into high volume production, package and test standardization is needed to offer cost-competitive without sacrificing performance.

The focus is creating a standard packaging solution to provide the flexibility to support multiple MEMS and Sensor applications. It should be customizable on the inside while remaining standard on the outside to maintain maximum compatibility during assembly, final test and surface board mount. It should allow the use of other packaging techniques like FlipStack® technology, through silicon via (TSV), Cu pillar, and die stacking on multiple substrate interfaces.

Sensors in Package – SiP solution integrates different MEMS and sensor functionalities with data processing ICs in multi-die package configuring and using different packaging techniques will be essential to achieving the deployment of anything close to a trillion sensors.

Heart Rate Monitoring for Mobile and Wearable Devices
Craig Easson, Managing Director, IC Design for the Sensors group in the Industrial & Healthcare Business Unit, Maxim Integrated

Heart rate monitoring has become ubiquitous in the wearables industry.· This talk will discuss the basic principles of photoplethysmography (PPG), the physiology involved and methods for measurement.· Design strategies will be introduced, and hardware and algorithm examples considered, including the trade-offs between integrated and discrete opto-mechanical architectures and the unique challenges presented for wearable and mobile applications.

The Role of Smart Sensors and Actuators in Simplifying IoT
Marcellino Gemelli, Director of Global Business Development, Bosch Sensortec

MEMS sensors and actuators are already contributing to the growth of IoT products and infrastructure, spanning numerous applications in our homes, offices, cities, vehicles and consumer electronics. We will analyze some of the growth challenges. One of the solutions we’ll analyze are “sensor bots” that reduce the amount of data transmitted to the cloud through computation at the leaf end of the network while at the same time reduce overall system power. The advanced sensor and actuator hubs simplify and enable the realization of new connected products and services, accelerating IoT’s promise to improve our world.

Reliability Challenges in MEMs and Sensor Technologies
Amit Marathe, Ph.D., SOC/Module Technology & Reliability Engineering Head, Google

The use of Micro-electromechanical systems (MEMs) is ever increasing in the world of smart devices, mobile technologies and ubiquitous computing. MEMs are commonly used as actuators and sensors in a broad spectrum of applications ranging from healthcare, automotive and military use to consumer electronics.

Deployment of sensor technologies into such a diverse set of devices and applications poses huge reliability challenges partly due to the complex usage profiles with user scenarios and environments these devices experience during field usage. MEMs devices often require interaction with the environment to perform their mission. Hence it is extremely important to evaluate the effects of environmental factors (such as temperature, humidity) as well as effects of human interaction (such as mechanical shock and vibration) on the reliability of these MEMs devices.

Another aspect that greatly influences reliability is the complex structure and manufacturing technology of MEMs devices. MEMs technology involves miniaturized mechanical and electromechanical elements that are made using the techniques of micro-fabrication. Dimensions of MEMs devices can vary from sub-micron to several millimeters and can have extremely complex electromechanical systems with multiple moving elements under the control of integrated microelectronics.

The talk will outline a reliability framework for sensor technologies and describe some of the common failure modes such as stiction. We will describe the process of establishing effective test methodologies that are representative of field usage scenarios to accelerate and precipitate these failure modes and make the qualification process more effective and meaningful. We will also outline various mitigation options to ensure long-term reliability of MEMs devices.

Additive Manufacturing for Direct Integration of 3D Sensors for IoT Applications
David Rahami, President & CEO, Optomec

We live in a 3-dimensional world, and to fully realize the IoT vision·of ubiquitous Smart Connected products, sensing and connectivity·must conform to that 3D reality. However, legacy Sensor & Antenna·production is generally 2D, failing to optimize for cost, size, weight·and performance when adapted to 3D products. This session describes·how 3D Printed Electronics solutions can directly print 3D Sensors and Antenna on existing structures, an essential building block for IoT rollout.

Printable Sensor types presented will include Strain, Creep, Current, Gas,·Temperature, RF, etc; as well as a wide variety of Antenna types including·Bluetooth, NFC, WiFi, etc.·Deposition·techniques such as Aerosol Jet, Inkjet·and Dispense will be·compared.

The benefits of a·direct digital approach·include lower manufacturing cost,·as well as functional benefits;·ie: a tightly coupled sensor provides more·sensitive data, which is critical·to maximizing LifeCycle savings in Industrial·applications, like Condition·Based Maintenance and Predictive Analytics. Some solutions are also applicable·to improving the packaging/assembly process for traditional·discrete sensors and antenna in a 3D setting.

Finally, emerging developments in the supply of standard printable sensor and antenna reference libraries will be discussed.

Rise of the Interaction Age – From MEMS and Sensors to Applications
Rajeev Rajan, Vice President, Product Marketing and Solutions – IoT, Automotive, and New Markets, GLOBALFOUNDRIES

MEMS and Sensors are enabling key functionalities and are the current battleground of the industry. Mobile Computing heralded the rapid integration and adoption of multi-capability sensors. This has driven the upward trajectory of the MEMS and Sensors adoption curve that has proliferated these technologies in the end products and applications for high-volume market segments such as the IoT, Industrial IoT, Automotive, AR / MR / VR, and Drones to name a few. These applications are also dependent on emerging SoC trends across various subsystems for compute, power, connectivity, content, security, and safety requirements. This presentation will share insight on the Sensor trends and landscape and how when combined with the power of SoCs impact the value up-the-stack for the Applications, and the role GLOBALFOUNDRIES semiconductor products and solutions in these spaces can differentiate them for the customers and industry.

Influence of multi-modality sensors on client platforms
Vinesh Sukumar, PhD, Director, Strategic Planning, Intel

There goes a saying that compute is the new digital oil. At Intel, we intend to make client platforms more intelligent and self-reliant with increased reliance on sensors. They provide a wealth of information that help evolve client platforms into providing new capabilities like smart home and enriching an experience like virtual reality on HMD’s. This paper is intended to provide an insight into how Intel working with several ecosystem players is making simple PC systems intelligent - They spread across doing simple tasks like waking up a computer if a register user is detected using a combination of presence and proximity detection sensors to complex workloads like enabling proper head pose estimation using 6DOF metrics to interact naturally with virtual characters in 3D space. Finally with new capabilities comes new challenges and how at Intel we embrace these challenges to drive better user experience.

Packaging in the New Era of MEMS and Sensors
E. Jan Vardaman, President and Founder, TechSearch International, Inc.

MEMS and Sensors are seeing explosive growth in applications ranging from automotive electronics to wearable electronics products such as activity monitoring including medical, wrist products, and clothing. This wide variety of applications creates new challenges for the packaging and assembly to meet the form factor, performance, reliability, and cost requirements for these diverse applications. Many wearable medical devices have been around for many years. The products typically collect and transmit data; therefore they use many MEMS, sensors, and processors. Augmented reality (AR) and virtual reality (VR) are growing applications that use a variety of MEMS and sensors. Textiles for electronic applications have special requirements including cost targets that may require the use of additive manufacturing solutions. Automotive applications require an increased number of sensors with reliability requirements not typically seen in other products. Products on the market today use many different packages including stacked packages (3D), BGAs, CSPs, WLPs, and leadframe packages such as QFNs. In many cases a system-in-package (SiP) approach may be required. No single package dominates any category, but increased cost sensitivity will place greater demands on package and assembly decisions. With so many choices, the challenge is selecting the correct package to meet the needs of performance, form factor, and function. This presentation examines trends in packages for MEMS and sensors used in these applications will discuss new packages and assembly methods being planned for future products. These new packaging and assembly methods will have profound impacts on the manufacturing processes used today. Low power requirements for many of these products will drive new developments in battery technology.

Co-design and Co-Analysis for Heterogeneous Integration
Brandon Wang, Group Director, Cadence Design Systems

This talk will discuss the Co-design and Co-analysis methodologies for heterogeneous integration in various SiP technologies. It starts with implementation platforms for TSV based 3D-IC, and Fan out packaging technologies. Wang will discuss design flows for digital centric SOC, RF and MEMS integrated SiP. The talk also covers the co-analysis methodologies including modeling, system level power integrity analysis, layer based thermal analysis, multi-die cross coupling analysis, and MEMs multi-physics sub-flow.