SMART Microsystems creates turn-key solutions for microelectronic package assembly challenges to move MEMS sensor technology from development to production. With an engineering team experienced in manufacturing and state-of-the-art facilities, SMART Microsystems accelerates the transition of new MEMS sensor products to market, providing the lowest overall development time and cost to satisfy full life cycle requirements. Visit www.smartmicrosystems.com for more information about SMART Microsystems capabilities and services.

SMART Microsystems creates turn-key solutions for microelectronic package assembly challenges to move MEMS sensor technology from development to production. With an engineering team experienced in manufacturing and state-of-the-art facilities, SMART Microsystems accelerates the transition of new MEMS sensor products to market, providing the lowest overall development time and cost to satisfy full life cycle requirements. Visit www.smartmicrosystems.com for more information about SMART Microsystems capabilities and services.

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Amkor Technology (Nasdaq: AMKR) is one of the world’s largest providers of advanced semiconductor assembly and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for many of the world’s leading semiconductor companies and electronics OEMs, providing our customers with the industry’s broadest array of package design, assembly and test solutions. Amkor’s operational base encompasses more than 10 million square feet of manufacturing facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.

www.amkor.com

REGISTRATION & PRICING

FRT of America is recognized as a valued partner for non-contact, optical metrology systems. FRT of America serves you by providing high-quality automated measuring tools that fulfill your research, inspection and process verification needs. The MicroProf® TTV measures wafer thickness, TTV, bow and warp for full thickness, thinned and bonded wafers. The WLI PI sensor is for measuring high aspect ratio trenches and bumped wafers and the CWL IR is for measuring silicon thickness on bonded wafers. The MicroSpy® Topo DT is a high resolution 3D profilometer with confocal and interferometric measuring modes.

www.frtofamerica.com

AmTECH Microelectronics, Inc. MICROELECTRONICS ASSEMBLY TECHNOLOGIES including ADVANCED PACKAGING and SMT ASSEMBLY on PCB, PCB-FLEX and CERAMIC substrates. We support high complexity and small miniature assemblies from PROTOTYPE to PRODUCTION. Our Silicon Valley facility includes 2,500 square feet CLEANROOM ISO 7 with on-site Process Development, Engineering and Manufacturing support. ADVANCED PACKAGING: We support precision Die Attach and Flip Chip with DATACON 2200 EVO Plus; Wire Bond (Au Ball, Au Wedge, Al Wedge) with KNS ICONN and H&K BJ820 and BJ815; and Encapsulation with Glob Top, Dam & Fill and UV materials with ASYMTEK S820 with Dispense JET and AUGER Pumps. SMT ASSEMBLY: Lead-free with 01005, BTC, QFN, WLCSP, uBGA and 0.4mm pitch IC and Connectors. PCB from 0.012” to 0.200”, PCB-FLEX from 0.004” to 0.010”, and CERAMIC 0.010” to 0.040” Thickness.

www.amtechmicro.com

AmTECH Microelectronics, Inc. MICROELECTRONICS ASSEMBLY TECHNOLOGIES including ADVANCED PACKAGING and SMT ASSEMBLY on PCB, PCB-FLEX and CERAMIC substrates. We support high complexity and small miniature assemblies from PROTOTYPE to PRODUCTION. Our Silicon Valley facility includes 2,500 square feet CLEANROOM ISO 7 with on-site Process Development, Engineering and Manufacturing support. ADVANCED PACKAGING: We support precision Die Attach and Flip Chip with DATACON 2200 EVO Plus; Wire Bond (Au Ball, Au Wedge, Al Wedge) with KNS ICONN and H&K BJ820 and BJ815; and Encapsulation with Glob Top, Dam & Fill and UV materials with ASYMTEK S820 with Dispense JET and AUGER Pumps. SMT ASSEMBLY: Lead-free with 01005, BTC, QFN, WLCSP, uBGA and 0.4mm pitch IC and Connectors. PCB from 0.012” to 0.200”, PCB-FLEX from 0.004” to 0.010”, and CERAMIC 0.010” to 0.040” Thickness.

www.amtechmicro.com

Sonoscan® provides non-destructive analysis for process control and quality assurance to safeguard your MEMs products as it accurately detects defects and process variations. Sonoscan offers instruments for the laboratory and automated test systems for Front, Mid and Back-End microelectronics. Including the C-SAM® AW series for various wafer configurations and the FACTS2™ DF2400™ for scanning MEMs devices in trays.

Sonoscan, the leader in Acoustic Microscopy (AM), manufactures systems in the USA with regional laboratories in Asia, Europe and the USA for AM inspection services. Our C-SAM® technologies have set the standard for 40 years.

www.sonoscan.com

Yield Engineering Systems, Inc. Meeting the stringent demands of companies worldwide, Yield Engineering Systems, Inc. (YES) manufactures processing equipment with cost-effective solutions for wafer-level packaging/redistribution layers, bioMEMS, semiconductor industries and more. YES manufactures high temperature vacuum cure ovens, polyimide cure ovens, silane vapor phase deposition systems, plasma etch and clean tools and vacuum bake/vapor prime ovens; Our proven applications include silane substrate adhesion for microarrays, biocompatibility, stiction reduction, wafer dehydration and surface tension modification. Designing and building products that increase yields, extend performance, and improve processes; all equipment is engineered, manufactured and tested in Livermore, California USA. The answer is YES to quality, flexibility, superior products and service.

www.yieldengineering.com

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

www.indium.com

Amkor Technology (Nasdaq: AMKR) is one of the world’s largest providers of advanced semiconductor assembly and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for many of the world’s leading semiconductor companies and electronics OEMs, providing our customers with the industry’s broadest array of package design, assembly and test solutions. Amkor’s operational base encompasses more than 10 million square feet of manufacturing facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.

www.amkor.com