SMART Microsystems creates turn-key solutions for microelectronic package assembly challenges to move MEMS sensor technology from development to production. With an engineering team experienced in manufacturing and state-of-the-art facilities, SMART Microsystems accelerates the transition of new MEMS sensor products to market, providing the lowest overall development time and cost to satisfy full life cycle requirements. Visit www.smartmicrosystems.com for more information about SMART Microsystems capabilities and services.

SMART Microsystems creates turn-key solutions for microelectronic package assembly challenges to move MEMS sensor technology from development to production. With an engineering team experienced in manufacturing and state-of-the-art facilities, SMART Microsystems accelerates the transition of new MEMS sensor products to market, providing the lowest overall development time and cost to satisfy full life cycle requirements. Visit www.smartmicrosystems.com for more information about SMART Microsystems capabilities and services.

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Amkor Technology (Nasdaq: AMKR) is one of the world’s largest providers of advanced semiconductor assembly and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for many of the world’s leading semiconductor companies and electronics OEMs, providing our customers with the industry’s broadest array of package design, assembly and test solutions. Amkor’s operational base encompasses more than 10 million square feet of manufacturing facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.

www.amkor.com

REGISTRATION & PRICING

FRT of America is recognized as a valued partner for non-contact, optical metrology systems. FRT of America serves you by providing high-quality automated measuring tools that fulfill your research, inspection and process verification needs. The MicroProf® TTV measures wafer thickness, TTV, bow and warp for full thickness, thinned and bonded wafers. The WLI PI sensor is for measuring high aspect ratio trenches and bumped wafers and the CWL IR is for measuring silicon thickness on bonded wafers. The MicroSpy® Topo DT is a high resolution 3D profilometer with confocal and interferometric measuring modes.

www.frtofamerica.com

AmTECH Microelectronics, Inc. MICROELECTRONICS ASSEMBLY TECHNOLOGIES including ADVANCED PACKAGING and SMT ASSEMBLY on PCB, PCB-FLEX and CERAMIC substrates. We support high complexity and small miniature assemblies from PROTOTYPE to PRODUCTION. Our Silicon Valley facility includes 2,500 square feet CLEANROOM ISO 7 with on-site Process Development, Engineering and Manufacturing support. ADVANCED PACKAGING: We support precision Die Attach and Flip Chip with DATACON 2200 EVO Plus; Wire Bond (Au Ball, Au Wedge, Al Wedge) with KNS ICONN and H&K BJ820 and BJ815; and Encapsulation with Glob Top, Dam & Fill and UV materials with ASYMTEK S820 with Dispense JET and AUGER Pumps. SMT ASSEMBLY: Lead-free with 01005, BTC, QFN, WLCSP, uBGA and 0.4mm pitch IC and Connectors. PCB from 0.012” to 0.200”, PCB-FLEX from 0.004” to 0.010”, and CERAMIC 0.010” to 0.040” Thickness.

www.amtechmicro.com

AmTECH Microelectronics, Inc. MICROELECTRONICS ASSEMBLY TECHNOLOGIES including ADVANCED PACKAGING and SMT ASSEMBLY on PCB, PCB-FLEX and CERAMIC substrates. We support high complexity and small miniature assemblies from PROTOTYPE to PRODUCTION. Our Silicon Valley facility includes 2,500 square feet CLEANROOM ISO 7 with on-site Process Development, Engineering and Manufacturing support. ADVANCED PACKAGING: We support precision Die Attach and Flip Chip with DATACON 2200 EVO Plus; Wire Bond (Au Ball, Au Wedge, Al Wedge) with KNS ICONN and H&K BJ820 and BJ815; and Encapsulation with Glob Top, Dam & Fill and UV materials with ASYMTEK S820 with Dispense JET and AUGER Pumps. SMT ASSEMBLY: Lead-free with 01005, BTC, QFN, WLCSP, uBGA and 0.4mm pitch IC and Connectors. PCB from 0.012” to 0.200”, PCB-FLEX from 0.004” to 0.010”, and CERAMIC 0.010” to 0.040” Thickness.

www.amtechmicro.com

Sonoscan® provides non-destructive analysis for process control and quality assurance to safeguard your MEMs products as it accurately detects defects and process variations. Sonoscan offers instruments for the laboratory and automated test systems for Front, Mid and Back-End microelectronics. Including the C-SAM® AW series for various wafer configurations and the FACTS2™ DF2400™ for scanning MEMs devices in trays.

Sonoscan, the leader in Acoustic Microscopy (AM), manufactures systems in the USA with regional laboratories in Asia, Europe and the USA for AM inspection services. Our C-SAM® technologies have set the standard for 40 years.

www.sonoscan.com

Yield Engineering Systems, Inc. Meeting the stringent demands of companies worldwide, Yield Engineering Systems, Inc. (YES) manufactures processing equipment with cost-effective solutions for wafer-level packaging/redistribution layers, bioMEMS, semiconductor industries and more. YES manufactures high temperature vacuum cure ovens, polyimide cure ovens, silane vapor phase deposition systems, plasma etch and clean tools and vacuum bake/vapor prime ovens; Our proven applications include silane substrate adhesion for microarrays, biocompatibility, stiction reduction, wafer dehydration and surface tension modification. Designing and building products that increase yields, extend performance, and improve processes; all equipment is engineered, manufactured and tested in Livermore, California USA. The answer is YES to quality, flexibility, superior products and service.

www.yieldengineering.com

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

www.indium.com

Amkor Technology (Nasdaq: AMKR) is one of the world’s largest providers of advanced semiconductor assembly and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for many of the world’s leading semiconductor companies and electronics OEMs, providing our customers with the industry’s broadest array of package design, assembly and test solutions. Amkor’s operational base encompasses more than 10 million square feet of manufacturing facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.

www.amkor.com

PROMEX Industries, located in Silicon Valley, provides one-stop microelectronics assembly, advanced packaging & semiconductor assembly services to the medical and bioscience, commercial semiconductor and military markets. Our technical staff applies deep materials science expertise with our uniquely broad process capabilities to responsively accelerate new products to market from concept through onshore production. PROMEX has a proven track record for the packaging development, launch support and volume production of innovative and complex microelectronics assemblies. Facilities include Class 100, Class 1000 clean rooms, integrated SMT / PCBA, development, assembly and test areas. Supply chain management and turnkey procurement available. ISO 13485:2003, ISO 9001:2008 certified and ITAR registered.

www.promex-ind.com

Gel-Pak develops unique materials for device handling. The Gel-Pak product line securely holds fragile components in place during shipping, handling, and processing. For over 30 years, the ISO certified company has been an industry leader in guaranteeing safe transport and storage of cutting-edge technologies ranging from 250µm chips to 300 mm wafers and substrates.

www.gelpak.com

Milestone Technology is a Failure Analysis Lab providing services for the MEMS, Semiconductor, LED, Medical Device, Solar, Electronics, Nanotech, Disk Drive, Optical, Coating, Ceramics and Materials industries. They specialize in Ultra High Resolution SEM, EDX, Quantitative Analysis, Mapping, Precision Cross-Sectioning, Surface Contamination, FTIR, PCB/BGA Inspection, Dye Pry, and Metallography.

www.milestonefalab.com

PROMEX Industries, located in Silicon Valley, provides one-stop microelectronics assembly, advanced packaging & semiconductor assembly services to the medical and bioscience, commercial semiconductor and military markets. Our technical staff applies deep materials science expertise with our uniquely broad process capabilities to responsively accelerate new products to market from concept through onshore production. PROMEX has a proven track record for the packaging development, launch support and volume production of innovative and complex microelectronics assemblies. Facilities include Class 100, Class 1000 clean rooms, integrated SMT / PCBA, development, assembly and test areas. Supply chain management and turnkey procurement available. ISO 13485:2003, ISO 9001:2008 certified and ITAR registered.

www.promex-ind.com

Silex Microsystems is the world’s largest pure-play MEMS foundry driving the sensory system revolution and partnering with the world’s most innovative companies to commercialize MEMS technologies that can change the world.

MEMS development requires deep specialized knowledge and expertise as a new device goes from prototype to qualification to mass production. Silex is dedicated to bring customers quickly, cost-effectively and reliably through the product development lifecycle with:

• Expertise in rapid commercialization of MEMS products
• Pioneering innovation that delivers transformative MEMS manufacturing capabilities
• Responsive Collaborative partnering driven to enable customers’ success, from project
inception to volume production
• Proven, stable, high-volume MEMS manufacturing capacity

www.silexmicrosystems.com

SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, and CVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets.

With the addition of SPTS, Orbotech is able to offer a broader range of process solutions for Advanced Packaging, which includes Orbotech’s Inkjet solutions for die level printing of package marking, underfill dams and isolation layers. SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific.

www.spts.com