John Baekelmans is Managing Director & Vice President at imec. As Managing Director for the Netherlands, he is responsible for the overall business and operations. Imec NL develops technologies for wireless autonomous sensing solutions, innovative health solutions and flexible electronics in an open innovation setting and in dedicated research trajectories.

Before imec, John spent 21 years at Cisco where he held various global leadership positions within Engineering, Services and the M&A departments and has authored numerous US and European patents. John was also the co-founder of a Belgian residential solutions startup called fifthplay. Before Cisco, John designed, implemented and operated large PBX-networks at Siemens.

John obtained a Masters degree in Computer Science from the University of Antwerp, Belgium and is a former Cisco Certified Internetwork Expert (CCIE). In his spare time, he is engaged in Belgium’s National fast response rescue team to assist in global disasters. He loves to ski, is an advanced scuba diver and currently lives in Eindhoven.

Cory Forbes serves as the CTO of Nypro, A Jabil Company and leads the global product development and technology teams. Nypro’s teams engage with many of the worlds leading OEM’s in the Diagnostic, Medical Device, Pharmaceutical, Test & Measurement and Consumer Health product domains. Cory has been with Jabil for more than 13 years and has held leadership positions in manufacturing, business management, supply chain, environmental design and product development. He received his Bachelors of Science Degree in Mechanical Engineering from the University of Alberta and has worked professionally in Canada, Brazil and the United States for Nortel Networks, Jabil and Nypro. His passions are in automotive and healthcare.


Len Sheynblat
is currently a Vice President of Engineering at Qualcomm Technologies Inc., where he is leading the next-generation UI Hearables project. Prior to that he was a technology lead at the Emerging Business Unit managing the portfolio of 12 businesses. In the previous 15 years at Qualcomm Mr Sheynblat directed the efforts of integrating sensors into wireless devices and led the engineering team responsible for deployment of wearable devices focusing on the real-world use cases. Prior to Qualcomm Mr. Sheynblat served as a Chief Architect at SnapTrack, a pioneer of Assisted GPS technology. In 1996 Mr. Sheynblat was honored as an Inventor of the Year by the Peninsula Intellectual Property Law Association.

Adrian Arcedera is Vice President of MEMS and Sensors at Amkor Technology. Adrian joined Amkor in 1997, and has served in various positions in product and business development and management of Amkor's chip scale products, including leading the platform development for Amkor's ChipArray¨ package. Currently Adrian is responsible for the business and platform development for MEMS & sensors packages and PBGA products. Prior to joining Amkor, Adrian was a materials engineer for Motorola in the Philippines. He holds a degree in chemical engineering from the University of the Philippines.


Craig Easson
is the Managing Director of IC Design for the Sensors group in the Industrial & Healthcare Business Unit. Since 2013, he has lead the design of various Bio Sensor Modules, including Maxim’s first heart rate monitor, ECG, and IR thermometer. With more than 17 years at Maxim, Craig has a deep understanding of the industry with experience designing Operational Amplifiers, Audio Drivers, Video Filters, and Display Driver ICs. Prior to joining Maxim, Craig worked for 8 years in the Medical Physics Department of Kings College Hospital. He gained his MSc in Microelectronics from the University of Southampton in the UK.




Marcellino Gemelli is currently based in Palo Alto (CA) responsible for business development of Bosch Sensortec's MEMS product portfolio and Bosch’s IoT wireless sensor network initiative. He received the ‘Laurea’ degree in Electronic Engineering at the University of Pavia, Italy in 1994, while in the Italian Army and an MBA from MIP, the Milano (Italy) Polytechnic business school. He previously held various engineering and product management positions at STMicroelectronics from 1995 to 2011 in the fields of MEMS, electronic design automation and data storage. He was contract professor for the Microelectronics course at the Milano (Italy) Polytechnic from 2000 to 2002.


Amit Marathe, Ph.D. is the head of SoC/Module Technology and Reliability Engineering team supporting all projects across Hardware Programs in Google at X (formerly Google X/Alphabet). He joined Google X/Alphabet in 2016 in the Central X Supplier Development Organization. In addition to developing new Suppliers & technologies to enable moonshots, he also led the silicon/packaging quality & reliability activities and supplier interface for all projects within X.

Prior to X Amit led and managed the Technology & Reliability Development Organization at AMD (which later transitioned to Global Foundries (GF), where he continued to lead the technology qualification of advanced nodes (16nm FinFETs & beyond) as well as Assembly/Packaging Reliability & Modeling. He also worked for Microsoft where he managed the Silicon/Packaging Operations & Reliability Org for all of Microsoft Hardware.

Rajeev Rajan is the Vice President of Marketing and Solutions for Internet of Things (IoT), Automotive, and New Markets at GLOBALFOUNDRIES. He drives the thought leadership, business management, vertical markets strategy, product marketing, executive messaging, and commercialization initiatives that bridge the market segments and solutions with GF’s products portfolio.

Prior to joining GLOBALFOUNDRIES, Rajeev was Sr. Director, Product Management and Marketing at Qualcomm Life Inc, where he led the product management and strategy for the company’s Medical IoT and Digital Health. Rajeev is the Founder and CTO of 2net™, a Digital Health start-up, which became the multi-million dollar Qualcomm healthcare company. Additionally at Qualcomm, he has held multiple technology, engineering, product, marketing, and strategy roles.

Rajeev holds a BS in Physics from St. Xavier’s College and a MS in Computer Science from Sardar Patel University, in Gujarat, India. He received his Executive MBA from the Rady School of Management at the University of California San Diego, CA and a MS in Biomedical Engineering from Case Western Reserve University.

David Ramahi has been an investor and member of the Optomec Board of Directors since 1998. In 2002, he joined the Company full time to lead its transition from initial technology development to commercial sales. Under Mr. Ramahi’s leadership, Optomec has set and executed a focused business strategy that has led to profitability and high revenue growth. More recently, he has overseen the expansion of the product portfolio to include Additive Manufacturing hardware and software solutions that are uniquely targeted at 3D Printed Electronics and the Internet of Things. Prior to Optomec, Mr. Ramahi was based in Belgium as the Director of European Sales for Rosetta Technologies, and following a successful acquisition acted as Director of European Major Accounts for Engineering Animation. Mr. Ramahi received his B.S. in Mechanical Engineering from the Massachusetts Institute of Technology.


Dr. Vinesh Sukumar is currently serving as Director, Strategic Planning in Intel working on Client platforms focusing on camera and computer vision solutions. He began his career working on JPL projects doing power management for aeronautical applications before moving into doing commercial camera solutions for mobile customers. While being one of the first of employees at Micron Imaging, he was the default ombudsman of the Mobile product engineering group and was successful in establishing several mobile design wins at Top Tier customers like Nokia, Motorola and Apple. While working full time, he was also able to get his Doctorate focusing on Camera System Solutions and a business degree specializing in Strategy and Operations. In his free time, he teaches SAT (MAT focused) at local Bay Area schools and plays professional Table Tennis.

E. Jan Vardaman
is President & Founder of TechSearch International. She is the editor of Surface Mount Technology: Recent Japanese Developments, co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbun), a columnist with Circuits Assembly Magazine, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She served on the NSF-sponsored World Technology Evaluation Center study team involved in investigating electronics manufacturing in Asia and on the US mission to study manufacturing in China. She is a member of IEEE CPMT, IMAPS, SMTA, and SEMI. She was elected to two terms on the IEEE CPMT Board of Governors. She received her BA in Economics and Business from Mercer University in Macon, Georgia in 1979 and her MA in Economics from the University of Texas at Austin in 1981. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

Brandon Wang is the Director, 3D IC Solutions, Silicon Realization Group at Cadence Design Systems, Inc.
Brandon oversees the overall Cadence 3DIC solution marketing and product management activities, as well as other enablement efforts with strategic foundry partners. Prior to joining Cadence, Brandon spent over 6 years at ARM, managing the Interface IP Group, and later the PHY product line, where he also served as a member of the Corporate Patent Review Committee, responsible for low power and highspeed circuits. Before that, Brandon was with UBICOM, a network processor startup that is now part of Qualcomm. Brandon holds 6 US patents, and has published at a number of IEEE conferences and in journal papers. Brandon also serves as a director on the board of CASPA, a nonprofit semiconductor organization. A graduate with a MSEE from New Jersey Institute of Technology, he also holds an MBA from the Wharton School at the University of Pennsylvania.