item11a
item11a item11a
item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a item11a
item11a QRTBanner120x90 item11a
item11a item11a
item11a
item11a item11a
item11a
item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a meptecimapsepsloc item11a
item11a perfectionproductNEW item11a
item11a
item11a

Wednesday, April 10, 2019
SEMI Global Headquarters
673 South Milpitas Blvd
Milpitas, CA 95035

• 11:30 am – 12:00 pm | Registration/Pizza
12:00 pm – 12:35 pm | MEPTEC/IMAPS Talk/Q&A
12:35 pm – ~1:15 pm | IEEE EPS Talk

This event will include two speakers.

MEPTEC/IMAPS presents:
Non-Destructive Characterization of Advanced IC Packages with Buried Features using 3D X-ray
T
homas Gregorich, Director of Business Development, ZEISS Semiconductor Manufacturing Technology  

IEEE EPS presents:
High Density D2W DBI Hybrid Bonding for 2.5D/3D Applications
Dr. Sitaram Arkalgud, Xperi      

MORE

item11a
item11a
item11a x270smartbanner4m9 item11a
item11a
item11a item11a
item11a
item11a item11a
item11a
item11a homepagedownloadl item11a
item11a item11a
item11a
item11a mbondfeb19 item11a
item11a
item11a
item11a item11a
item11a
item11a cmse2019415x1 item11a
item11a
item11a seco19registerno item11a
item11a
item11a
item11a taptimeslogosm2 item11a
item11a globalsmtelectron item11a
item11a
item11a
item11a item11a item11a
item11a
meptecdigital120x
tanakawwwmeptec12
Join our MEPTEC email list

Resources/2011%20Web%20Header%20ROLLOVER1_slide_moo-ss_item662_81_moo1-1p3_.jpgResources/2011%20Web%20Header%20ROLLOVER1_tn_moo-ss_item640_72_moo1-1p3_.jpg

Resources/2011%20Web%20Header%20ROLLOVER2_slide_moo-ss_item653_5_moo1-1p3_.jpgResources/2011%20Web%20Header%20ROLLOVER2_tn_moo-ss_item665_14_moo1-1p3_.jpg

Resources/2011%20Web%20Header%20ROLLOVER3_slide_moo-ss_item645_54_moo1-1p3_.jpgResources/2011%20Web%20Header%20ROLLOVER3_tn_moo-ss_item691_63_moo1-1p3_.jpg

Resources/2011%20Web%20Header%20ROLLOVER4_slide_moo-ss_item682_79_moo1-1p3_.jpgResources/2011%20Web%20Header%20ROLLOVER4_tn_moo-ss_item683_75_moo1-1p3_.jpg
Read Current Issue Online
Read Media Kit Online

MEPTEC (MicroElectronics Packaging and Test Engineering Council) is a trade association of semiconductor suppliers, manufacturers, and vendors concerned exclusively with packaging, assembly, and test. Since its inception over 30 years ago, MEPTEC has provided a forum for semiconductor packaging and test professionals to learn and exchange ideas that relate to packaging, assembly, and test. Through our monthly luncheons, symposiums, and an Advisory Board consisting of individuals from all segments of the semiconductor industry, MEPTEC continuously strives to improve and elevate the roles of assembly and test professionals in the industry.

Spring2019MEPTECReportCoverSm
Spring2019MEPTECReportCoverSm