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MEPTEC (MicroElectronics Packaging and Test Engineering Council) is a trade association of semiconductor suppliers, manufacturers, and vendors concerned exclusively with packaging, assembly, and test. Since its inception over 30 years ago, MEPTEC has provided a forum for semiconductor packaging and test professionals to learn and exchange ideas that relate to packaging, assembly, and test. Through our monthly luncheons, symposiums, and an Advisory Board consisting of individuals from all segments of the semiconductor industry, MEPTEC continuously strives to improve and elevate the roles of assembly and test professionals in the industry.

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Wednesday, June 12, 2019 / 11:30 am — 1:00 pm
SEMI Global Headquarters
673 South Milpitas Blvd
Milpitas, CA 95035

MEPTEC/IMAPS presents:
The SiP Toolbox: Enabling Mobility, Ubiquity, and Autonomy for a Smart World
Eelco Bergman, Sr. Director of Technical Marketing, ASE Group

Heterogeneous Integration through SiP is enabling  significant innovation  across dynamic application areas including IoT, AI, 5G, automotive and mobile. As device functionality and performance requirements become increasingly more sophisticated, the industry is looking for flexible, powerful integration technologies as a way to achieve criteria for smaller footprint, lower power, and higher bandwidth at competitive cost, without full reliance on Moore’s Law. During his lunchtime talk, ASE’s Eelco Bergman will lift the lid on the SiP toolbox, and explore innovative technologies such as die interconnection, embedded devices, conformal shielding, integrated antenna, and others, which are constantly being enhanced to achieve higher levels of system integration. Eelco will also underscore the importance of integration technologies for our semiconductor ecosystem as we collectively enable the complex devices that will continue to make our world smarter.

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