MEPTEC (MicroElectronics Packaging and Test Engineering Council) is a trade association of semiconductor suppliers, manufacturers, and vendors concerned exclusively with packaging, assembly, and test. Since its inception over 30 years ago, MEPTEC has provided a forum for semiconductor packaging and test professionals to learn and exchange ideas that relate to packaging, assembly, and test. Through our monthly luncheons, symposiums, and an Advisory Board consisting of individuals from all segments of the semiconductor industry, MEPTEC continuously strives to improve and elevate the roles of assembly and test professionals in the industry.
There will be no luncheon held in July
Please join us for our next luncheon...
Wednesday, August 21, 2019 / 11:30 am — 1:00 pm
SEMI Global Headquarters
673 South Milpitas Blvd
Milpitas, CA 95035
The August Speaker Series will include two speakers:
Inline Process Control and Inspection: Enabling the Next Generation of Advanced SiP Manufacturing
Dave Adler, CEO, President and Board Chair, SVXR
Packaging is a tough business: while IC packages are becoming more complex and difficult to manufacture, customers are pushing for fewer – or zero – defects. These pressures can increase development times, production risks and manufacturing costs. Better inline inspection and process control tools can help. A new x-ray technology, developed specifically for advanced packaging, detects subtle process changes that affect yield and reliability. The system uses high-speed imaging--up to 100x faster than existing x-ray systems--and advanced machine learning techniques to capture process changes and latent defects that impact product yield and reliability. The result is real-time process control and defect detection for advanced packaging.
Semiconductor Manufacturing Strategy: Where in the World to Locate a Fab or Cleanroom?
Stephen Rothrock, President & CEO, ATREG
Despite optimistic growth forecasts amid a tight manufacturing asset market, global uncertainty generated by trade wars is causing anxiety among companies who have to constantly rethink their manufacturing strategies. In 2019, manufacturing assets will continue to play an essential part in shaping these strategies to ensure global competitive advantage as more wafers are needed and more facilities are being built. Despite a slowdown in semiconductor M&A activity, consolidation will continue, putting a strain on manufacturing space and resulting in new capital projects and expansions difficult to fulfill. A shortage of manufacturing space means cleanrooms and operational fabs will sell at a premium. There is still a shortage of used and new production tools with lead times in excess of one year to purchase new fabs from OEMs or equip new fabs. Stephen Rothrock will provide insights into how to best approach manufacturing strategy decisions in the context of today’s global semiconductor landscape.